Shintaro Nakashima

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Tokushima-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Light emitting device having wire including stack structure
- Patent number 10,069,053
- Issue date Sep 4, 2018
- Nichia Corporation
- Shinya Okura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device
- Patent number 7,709,854
- Issue date May 4, 2010
- Nichia Corporation
- Yoshitaka Bando
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded package and semiconductor device using molded package
- Patent number 7,462,870
- Issue date Dec 9, 2008
- Nichia Corporation
- Shintaro Nakashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded package and semiconductor device using molded package
- Patent number 7,045,905
- Issue date May 16, 2006
- Nichia Corporation
- Shintaro Nakashima
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LIGHT EMITTING DEVICE
- Publication number 20150091027
- Publication date Apr 2, 2015
- Nichia Corporation.
- Shinya OKURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE
- Publication number 20080083931
- Publication date Apr 10, 2008
- Nichia Corporation.
- Yoshitaka Bando
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molded package and semiconductor device using molded package
- Publication number 20060175716
- Publication date Aug 10, 2006
- Shintaro Nakashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molded package and semiconductor device using molded package
- Publication number 20040256706
- Publication date Dec 23, 2004
- Shintaro Nakashima
- H01 - BASIC ELECTRIC ELEMENTS