Shintaro Yamamichi

Follow

Person

Kunitachi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method of forming a solder bump on a substrate
- Patent number 9,520,375
- Issue date Dec 13, 2016
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INJECTION MOLDED SOLDER HEAD WITH IMPROVED SEALING PERFORMANCE
- Publication number 20230154887
- Publication date May 18, 2023
- International Business Machines Corporation
- Sayuri Hada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming a Solder Bump on a Substrate
- Publication number 20160322319
- Publication date Nov 3, 2016
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS