Shinya Esaki

Person

Osaka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit device packaging structure and packaging method
- Patent number 7,663,200
- Issue date Feb 16, 2010
- Panasonic Corporation
- Yasufumi Shirakawa
- G11 - INFORMATION STORAGE
Information Patent Grant
Integrated circuit device packaging structure and packaging method
- Patent number 7,250,664
- Issue date Jul 31, 2007
- Matsushita Electric Industrial Co., Ltd.
- Yasufumi Shirakawa
- G11 - INFORMATION STORAGE
Information Patent Grant
Integrated circuit device installed structure and installation method
- Patent number 6,924,540
- Issue date Aug 2, 2005
- Matsushita Electric Industrial Co., Ltd.
- Yasufumi Shirakawa
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
Integrated circuit device packaging structure and packaging method
- Publication number 20050151216
- Publication date Jul 14, 2005
- Matsushita Electric Industrial Co., Ltd.
- Yasufumi Shirakawa
- G11 - INFORMATION STORAGE
Information Patent Application
Integrated circuit device packaging structure and packaging method
- Publication number 20050151217
- Publication date Jul 14, 2005
- Matsushita Electric Industrial Co., Ltd.
- Yasufumi Shirakawa
- G11 - INFORMATION STORAGE
Information Patent Application
Optical integrated device
- Publication number 20050147011
- Publication date Jul 7, 2005
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Shinya Esaki
- G11 - INFORMATION STORAGE
Information Patent Application
Integrated circuit device packaging structure and packaging method
- Publication number 20040217363
- Publication date Nov 4, 2004
- Matsushita Electric Industrial Co., Ltd.
- Yasufumi Shirakawa
- G11 - INFORMATION STORAGE
Information Patent Application
Integrated circuit device installed structure and installation method
- Publication number 20040089859
- Publication date May 13, 2004
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Yasufumi Shirakawa
- G11 - INFORMATION STORAGE
Information Patent Application
Integrated circuit device packaging structure and packaging method
- Publication number 20030197258
- Publication date Oct 23, 2003
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Yasufumi Shirakawa
- G11 - INFORMATION STORAGE

Shinya Esaki

Person

Patents Grantslast 30 patents

Integrated circuit device packaging structure and packaging method

Integrated circuit device packaging structure and packaging method

Integrated circuit device installed structure and installation method

Patents Applicationslast 30 patents

Integrated circuit device packaging structure and packaging method

Integrated circuit device packaging structure and packaging method

Optical integrated device

Integrated circuit device packaging structure and packaging method

Integrated circuit device installed structure and installation method

Integrated circuit device packaging structure and packaging method