TREA

Shinya HONDA

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  • Tokyo, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Wafer processing method
    • Patent number 11,462,439
    • Issue date Oct 4, 2022
    • Disco Corporation
    • Hironari Ohkubo
    • G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

  • Information Patent Application

    LASER PROCESSING APPARATUS
    • Publication number 20220118547
    • Publication date Apr 21, 2022
    • Disco Corporation
    • Hironari OHKUBO
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ULTRAVIOLET LIGHT-INDUCED INFLAMMATION SUPPRESSING AGENT COMPRISING...
    • Publication number 20210353701
    • Publication date Nov 18, 2021
    • Shiseido Company, Ltd.
    • Tatsuya HASEGAWA
    • A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20210111075
    • Publication date Apr 15, 2021
    • Disco Corporation
    • Hironari OHKUBO
    • G06 - COMPUTING CALCULATING COUNTING