Shinya Iida

Person

Ayase-shi, Kanagawa-ken, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Wafer flattening process and storage medium
- Patent number 6,496,748
- Issue date Dec 17, 2002
- SpeedFam Co., Ltd.
- Michihiko Yanagisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer etching method
- Patent number 6,451,217
- Issue date Sep 17, 2002
- SpeedFam-IPEC Co., Ltd.
- Michihiko Yanagisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer flattening system
- Patent number 6,360,687
- Issue date Mar 26, 2002
- SpeedFam-IPEC Co., Ltd.
- Michihiko Yanagisawa
- B24 - GRINDING POLISHING
Information Patent Grant
Corrosion-resistant system and method for a plasma etching apparatus
- Patent number 6,316,369
- Issue date Nov 13, 2001
- Speedfam Co., Ltd
- Michihiko Yanagisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma etching apparatus
- Patent number 6,306,245
- Issue date Oct 23, 2001
- Michihiko Yanagisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer flattening process and system
- Patent number 6,280,645
- Issue date Aug 28, 2001
- Yasuhiro Horiike and SpeedFam Co, Ltd.
- Michihiko Yanagisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Combined CMP and plasma etching wafer flattening system
- Patent number 6,254,718
- Issue date Jul 3, 2001
- SpeedFam Co., Ltd.
- Chikai Tanaka
- B24 - GRINDING POLISHING
Information Patent Grant
Plasma etching method and plasma etching system for carrying out th...
- Patent number 6,159,388
- Issue date Dec 12, 2000
- Speedfam Co., Ltd.
- Michihiko Yanagisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Slurry recycling system of CMP apparatus and method of same
- Patent number 6,126,531
- Issue date Oct 3, 2000
- Speedfam Co., Ltd.
- Shinya Iida
- B24 - GRINDING POLISHING
Information Patent Grant
Slurry recycling system and method for CMP apparatus
- Patent number 6,106,728
- Issue date Aug 22, 2000
- Shinya Iida
- B24 - GRINDING POLISHING
Information Patent Grant
Plasma etching method
- Patent number 5,980,769
- Issue date Nov 9, 1999
- Speedfam Co., Ltd.
- Michihiko Yanagisawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Local etching apparatus and local etching method
- Publication number 20020008082
- Publication date Jan 24, 2002
- SpeedFam Co., Ltd.
- Chikai Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCAL ETCHING APPARATUS AND LOCAL ETCHING METHOD
- Publication number 20010032705
- Publication date Oct 25, 2001
- TAKESHI SADOHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer flattening process and system
- Publication number 20010007275
- Publication date Jul 12, 2001
- SpeedFam Co., Ltd.
- Michihiko Yanagisawa
- H01 - BASIC ELECTRIC ELEMENTS

Shinya Iida

Person

Patents Grantslast 30 patents

Wafer flattening process and storage medium

Wafer etching method

Wafer flattening system

Corrosion-resistant system and method for a plasma etching apparatus

Plasma etching apparatus

Wafer flattening process and system

Combined CMP and plasma etching wafer flattening system

Plasma etching method and plasma etching system for carrying out th...

Slurry recycling system of CMP apparatus and method of same

Slurry recycling system and method for CMP apparatus

Plasma etching method

Patents Applicationslast 30 patents

Local etching apparatus and local etching method

LOCAL ETCHING APPARATUS AND LOCAL ETCHING METHOD

Wafer flattening process and system