Shinya Kanno

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Nishishirakawa, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method for processing wafer
- Patent number 9,490,180
- Issue date Nov 8, 2016
- Shin-Etsu Handotai Co., Ltd.
- Shinya Kanno
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR PROCESSING WAFER
- Publication number 20140320867
- Publication date Oct 30, 2014
- Shin-Etsu Handotai Co., Ltd.
- Shinya Kanno
- G01 - MEASURING TESTING