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Shinya Kubota
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Chiba, JP
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Patents Grants
last 30 patents
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Patent Grant
Method of manufacturing resin-encapsulated semiconductor device, an...
Patent number
9,679,835
Issue date
Jun 13, 2017
SII Semiconductor Corporation
Shinya Kubota
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing resin-encapsulated semiconductor device, an...
Patent number
9,184,116
Issue date
Nov 10, 2015
Seiko Instruments Inc.
Shinya Kubota
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20170040186
Publication date
Feb 9, 2017
SII Semiconductor Corporation
Shinya KUBOTA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE, AN...
Publication number
20150287669
Publication date
Oct 8, 2015
SEIKO INSTRUMENTS INC.
Shinya KUBOTA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE, AN...
Publication number
20140224534
Publication date
Aug 14, 2014
Seiko Instruments Inc.
Shinya KUBOTA
H01 - BASIC ELECTRIC ELEMENTS