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Shinya Oota
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Osaka, JP
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last 30 patents
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Patent Grant
Method for producing multilayer wiring circuit board
Patent number
6,851,599
Issue date
Feb 8, 2005
Nitto Denko Corporation
Kei Nakamura
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
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Patent Application
Method for producing multilayer wiring circuit board
Publication number
20040011855
Publication date
Jan 22, 2004
Kei Nakamura
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR