Shinya YANBE

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Tochigi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Heat dissipation structure of a print circuit board
- Patent number 8,039,752
- Issue date Oct 18, 2011
- Keihin Corporation
- Shinya Yanbe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
HEAT DISSIPATION STRUCTURE OF A PRINT CIRCUIT BOARD
- Publication number 20090211788
- Publication date Aug 27, 2009
- Keihin Corporation
- Shinya YANBE
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...