Shiqin Xiao

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Mie-ken, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method for the formation of copper wiring films
- Patent number 6,562,219
- Issue date May 13, 2003
- Anelva Corporation
- Akiko Kobayashi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
Method for the formation of copper wiring films
- Publication number 20020134686
- Publication date Sep 26, 2002
- Akiko Kobayashi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...