Shirish Pethe

Person

Cupertino, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Methods and apparatus for forming dual metal interconnects
- Patent number 11,948,885
- Issue date Apr 2, 2024
- Applied Materials, Inc.
- Suketu A Parikh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of depositing multilayer stack including copper over feature...
- Patent number 11,562,925
- Issue date Jan 24, 2023
- Applied Materials, Inc.
- Shirish Pethe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate temperature non-uniformity reduction over target life usi...
- Patent number 11,492,699
- Issue date Nov 8, 2022
- Applied Materials, Inc.
- Suhas Bangalore Umesh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods for selective deposition of tungsten atop a dielectric laye...
- Patent number 11,417,568
- Issue date Aug 16, 2022
- Applied Materials, Inc.
- Wei Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for processing a substrate
- Patent number 11,315,771
- Issue date Apr 26, 2022
- Applied Materials, Inc.
- Xiangjin Xie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods and apparatus for filling a feature disposed in a substrate
- Patent number 11,289,329
- Issue date Mar 29, 2022
- Applied Materials, Inc.
- Rui Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for semi-dynamic bottom up reflow
- Patent number 11,222,816
- Issue date Jan 11, 2022
- Applied Materials, Inc.
- Lanlan Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for forming dual metal interconnects
- Patent number 11,075,165
- Issue date Jul 27, 2021
- Applied Materials, Inc.
- Suketu A Parikh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of ALD copper with high temperature PVD copper depositi...
- Patent number 10,892,186
- Issue date Jan 12, 2021
- Applied Materials, Inc.
- Ben-Li Sheu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
Buffer Layer for Dielectric Protection in Physical Vapor Deposition...
- Publication number 20240145300
- Publication date May 2, 2024
- Sahil PATEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING METAL GAPFILL WITH LOW RESISTIVITY
- Publication number 20240088071
- Publication date Mar 14, 2024
- Applied Materials, Inc.
- Yi XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED PVD TUNGSTEN LINER AND SEAMLESS CVD TUNGSTEN FILL
- Publication number 20240087955
- Publication date Mar 14, 2024
- Applied Materials, Inc.
- Yi XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TREATMENT OF TUNGSTEN SURFACE FOR TUNGSTEN GAP-FILL
- Publication number 20230420295
- Publication date Dec 28, 2023
- Applied Materials, Inc.
- Tsung-Han YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF FIELD-SUPPRESSION CVD TUNGSTEN (W) FILL ON PVD W LINER
- Publication number 20230326791
- Publication date Oct 12, 2023
- Applied Materials, Inc.
- Zhimin QI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF DEPOSITING LAYERS
- Publication number 20230122969
- Publication date Apr 20, 2023
- Applied Materials, Inc.
- Shirish PETHE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED STRESS TUNING AND INTERFACIAL ADHESION FOR TUNGSTEN (W) GA...
- Publication number 20230023235
- Publication date Jan 26, 2023
- Xi CEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR SHAPING MAGNETIC FIELDS DURING SEMICONDUCTOR PROCESSING
- Publication number 20220380888
- Publication date Dec 1, 2022
- Goichi YOSHIDOME
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE TEMPERATURE NON-UNIFORMITY REDUCTION OVER TARGET LIFE USI...
- Publication number 20220259720
- Publication date Aug 18, 2022
- Applied Materials, Inc.
- Suhas BANGALORE UMESH
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE
- Publication number 20220020578
- Publication date Jan 20, 2022
- Applied Materials, Inc.
- Xiangjin XIE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS AND APPARATUS FOR SEMI-DYNAMIC BOTTOM UP REFLOW
- Publication number 20210391214
- Publication date Dec 16, 2021
- Applied Materials, Inc.
- Lanlan ZHONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR SELECTIVE DEPOSITION OF TUNGSTEN ATOP A DIELECTRIC LAYE...
- Publication number 20210320034
- Publication date Oct 14, 2021
- Applied Materials, Inc.
- Wei LEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR FORMING DUAL METAL INTERCONNECTS
- Publication number 20210320064
- Publication date Oct 14, 2021
- Applied Materials, Inc.
- SUKETU A. PARIKH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DEPOSITING LAYERS
- Publication number 20210118729
- Publication date Apr 22, 2021
- Applied Materials, Inc.
- Shirish PETHE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR FORMING DUAL METAL INTERCONNECTS
- Publication number 20210020569
- Publication date Jan 21, 2021
- Applied Materials, Inc.
- SUKETU A. PARIKH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR FILLING A FEATURE DISPOSED IN A SUBSTRATE
- Publication number 20200350159
- Publication date Nov 5, 2020
- Applied Materials, Inc.
- Rui LI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Integration Of ALD Copper With High Temperature PVD Copper Depositi...
- Publication number 20190115254
- Publication date Apr 18, 2019
- Applied Materials, Inc.
- Ben-Li Sheu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Shirish Pethe

Person

Patents Grantslast 30 patents

Methods and apparatus for forming dual metal interconnects

Method of depositing multilayer stack including copper over feature...

Substrate temperature non-uniformity reduction over target life usi...

Methods for selective deposition of tungsten atop a dielectric laye...

Methods and apparatus for processing a substrate

Methods and apparatus for filling a feature disposed in a substrate

Methods and apparatus for semi-dynamic bottom up reflow

Methods and apparatus for forming dual metal interconnects

Integration of ALD copper with high temperature PVD copper depositi...

Patents Applicationslast 30 patents

Buffer Layer for Dielectric Protection in Physical Vapor Deposition...

METHODS FOR FORMING METAL GAPFILL WITH LOW RESISTIVITY

INTEGRATED PVD TUNGSTEN LINER AND SEAMLESS CVD TUNGSTEN FILL

TREATMENT OF TUNGSTEN SURFACE FOR TUNGSTEN GAP-FILL

SELF FIELD-SUPPRESSION CVD TUNGSTEN (W) FILL ON PVD W LINER

METHOD OF DEPOSITING LAYERS

ENHANCED STRESS TUNING AND INTERFACIAL ADHESION FOR TUNGSTEN (W) GA...

METHODS FOR SHAPING MAGNETIC FIELDS DURING SEMICONDUCTOR PROCESSING

SUBSTRATE TEMPERATURE NON-UNIFORMITY REDUCTION OVER TARGET LIFE USI...

METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE

METHODS AND APPARATUS FOR SEMI-DYNAMIC BOTTOM UP REFLOW

METHODS FOR SELECTIVE DEPOSITION OF TUNGSTEN ATOP A DIELECTRIC LAYE...

METHODS AND APPARATUS FOR FORMING DUAL METAL INTERCONNECTS

METHOD OF DEPOSITING LAYERS

METHODS AND APPARATUS FOR FORMING DUAL METAL INTERCONNECTS

METHODS AND APPARATUS FOR FILLING A FEATURE DISPOSED IN A SUBSTRATE

Integration Of ALD Copper With High Temperature PVD Copper Depositi...