Shirish Shah

Person

Milpitas, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
System and method for determining placement of photovoltaic strips...
- Patent number 8,361,259
- Issue date Jan 29, 2013
- Solaria Corporation
- Shirish Shah
- B32 - LAYERED PRODUCTS
Information Patent Grant
System and method for increasing yield from semiconductor wafer ele...
- Patent number 7,641,776
- Issue date Jan 5, 2010
- LSI Corporation
- Mohan Nagar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of balanced coefficient of thermal expansion for flip chip b...
- Patent number 6,806,119
- Issue date Oct 19, 2004
- LSI Logic Corporation
- Kumar Nagarajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Balanced coefficient of thermal expansion for flip chip ball grid a...
- Patent number 6,639,321
- Issue date Oct 28, 2003
- LSI Logic Corporation
- Kumar Nagarajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for cleaning and removing flux from an electro...
- Patent number 6,395,097
- Issue date May 28, 2002
- LSI Logic Corporation
- Abhay Maheshwari
- C03 - GLASS MINERAL OR SLAG WOOL

Patents Applicationslast 30 patents

Information Patent Application
SYSTEM AND METHOD FOR DETERMINING PLACEMENT OF PHOTOVOLTAIC STRIPS...
- Publication number 20130206208
- Publication date Aug 15, 2013
- Solaria Corporation
- Shirish Shah
- B32 - LAYERED PRODUCTS
Information Patent Application
SYSTEM AND METHOD FOR DETERMINING PLACEMENT OF PHOTOVOLTAIC STRIPS...
- Publication number 20120067397
- Publication date Mar 22, 2012
- Solaria Corporation
- Shirish Shah
- B32 - LAYERED PRODUCTS
Information Patent Application
SOLDER REPLACEMENT BY CONDUCTIVE TAPE MATERIAL
- Publication number 20090266403
- Publication date Oct 29, 2009
- Solaria Corporation
- Shirish Shah
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
METHOD AND MATERIAL FOR COUPLING SOLAR CONCENTRATORS AND PHOTOVOLTA...
- Publication number 20090151770
- Publication date Jun 18, 2009
- Solaria Corporation
- KEVIN R. GIBSON
- B32 - LAYERED PRODUCTS
Information Patent Application
System and method for increasing yield from semiconductor wafer ele...
- Publication number 20060201802
- Publication date Sep 14, 2006
- Mohan Nagar
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method of protecting fuses in an integrated circuit die
- Publication number 20060128072
- Publication date Jun 15, 2006
- LSI Logic Corporation
- Sarathy Rajagopalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip chip underfilling
- Publication number 20060099736
- Publication date May 11, 2006
- Mohan R. Nagar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Novel solution for low cost, speedy probe cards
- Publication number 20040239350
- Publication date Dec 2, 2004
- Mohan R. Nagar
- G01 - MEASURING TESTING
Information Patent Application
Method of balanced coefficient of thermal expansion for flip chip b...
- Publication number 20040121519
- Publication date Jun 24, 2004
- Kumar Nagarajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Underfill gap enhancement
- Publication number 20040070073
- Publication date Apr 15, 2004
- Shirish Shah
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Shirish Shah

Person

Patents Grantslast 30 patents

System and method for determining placement of photovoltaic strips...

System and method for increasing yield from semiconductor wafer ele...

Method of balanced coefficient of thermal expansion for flip chip b...

Balanced coefficient of thermal expansion for flip chip ball grid a...

Method and apparatus for cleaning and removing flux from an electro...

Patents Applicationslast 30 patents

SYSTEM AND METHOD FOR DETERMINING PLACEMENT OF PHOTOVOLTAIC STRIPS...

SYSTEM AND METHOD FOR DETERMINING PLACEMENT OF PHOTOVOLTAIC STRIPS...

SOLDER REPLACEMENT BY CONDUCTIVE TAPE MATERIAL

METHOD AND MATERIAL FOR COUPLING SOLAR CONCENTRATORS AND PHOTOVOLTA...

System and method for increasing yield from semiconductor wafer ele...

Method of protecting fuses in an integrated circuit die

Flip chip underfilling

Novel solution for low cost, speedy probe cards

Method of balanced coefficient of thermal expansion for flip chip b...

Underfill gap enhancement