Shiro AMAGAI

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Nishigo-mura, JP

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Patents Grantslast 30 patents

Information Patent Grant
Double-side polishing method and double-side polishing apparatus
- Patent number 11,325,220
- Issue date May 10, 2022
- Shin-Etsu Handotai Co., Ltd.
- Yuki Tanaka
- B24 - GRINDING POLISHING
Information Patent Grant
Method for manufacturing semiconductor wafer
- Patent number 10,395,933
- Issue date Aug 27, 2019
- Shin-Etsu Handotai Co., Ltd.
- Yoshihiro Usami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sizing device, polishing apparatus, and polishing method
- Patent number 10,147,656
- Issue date Dec 4, 2018
- Shin-Etsu Handotai Co., Ltd.
- Shigeru Oba
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
DOUBLE-SIDE POLISHING METHOD AND DOUBLE-SIDE POLISHING APPARATUS
- Publication number 20180361530
- Publication date Dec 20, 2018
- Shin-Etsu Handotai Co., Ltd.
- Yuki TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR WAFER
- Publication number 20180226258
- Publication date Aug 9, 2018
- Shin-Etsu Handotai Co., Ltd.
- Yoshihiro USAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIZING DEVICE, POLISHING APPARATUS, AND POLISHING METHOD
- Publication number 20180138097
- Publication date May 17, 2018
- Shin-Etsu Handotai Co., Ltd.
- Shigeru OBA
- H01 - BASIC ELECTRIC ELEMENTS