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Shiro Yamashita

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  • Fujisawa, JP
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    Electronic Control Device
    • Publication number 20220295642
    • Publication date Sep 15, 2022
    • Hitachi Astemo, Ltd.
    • Osamu IKEDA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Circuit Board
    • Publication number 20220271453
    • Publication date Aug 25, 2022
    • Hitachi Astemo, Ltd.
    • Shinya KAWAKITA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Electronic Control Device
    • Publication number 20200352056
    • Publication date Nov 5, 2020
    • Hitachi Automotive Systems, Ltd.
    • Isamu YOSHIDA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    POWER MODULE
    • Publication number 20180005986
    • Publication date Jan 4, 2018
    • Hitachi Automotive Systems, Ltd.
    • Shiro YAMASHITA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Electronic Control Device
    • Publication number 20160073504
    • Publication date Mar 10, 2016
    • Hitachi Automotive Systems, Ltd.
    • Miki HIRAOKA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Semiconductor Device and Production Method for Same
    • Publication number 20150294927
    • Publication date Oct 15, 2015
    • Hitachi Automotive Systems ,Ltd.
    • Shiro Yamashita
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Power Module and Method of Manufacturing the Power Module
    • Publication number 20140110752
    • Publication date Apr 24, 2014
    • Hitachi Automotive Systems, Ltd.
    • Shinichi Fujino
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Semiconductor Device
    • Publication number 20110058342
    • Publication date Mar 10, 2011
    • Hitachi, Ltd
    • Shinya Kawakita
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Connection Structure, Power Module and Method of Manufacturing the...
    • Publication number 20100206632
    • Publication date Aug 19, 2010
    • Hitachi Automotive Systems, Ltd.
    • Ukyo IKEDA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Electronic device and on-vehicle module
    • Publication number 20090233468
    • Publication date Sep 17, 2009
    • Shiro Yamashita
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    POWER SEMICONDUCTOR MODULE
    • Publication number 20080061431
    • Publication date Mar 13, 2008
    • Shinichi Fujiwara
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Semiconductor module
    • Publication number 20070069344
    • Publication date Mar 29, 2007
    • Shiro Yamashita
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Electronic device
    • Publication number 20060234420
    • Publication date Oct 19, 2006
    • Takehide Yokozuka
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Semiconductor device
    • Publication number 20060163745
    • Publication date Jul 27, 2006
    • Shiro Yamashita
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Semiconductor device and manufacturing method thereof
    • Publication number 20060151877
    • Publication date Jul 13, 2006
    • Shiro Yamashita
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Electronic device
    • Publication number 20060068609
    • Publication date Mar 30, 2006
    • Takehide Yokozuka
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Method for removing solder bumps from LSI
    • Publication number 20040206805
    • Publication date Oct 21, 2004
    • Hitachi, Ltd
    • Motoko Kimura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Method for manufacturing semiconductor device and electronic device...
    • Publication number 20030230806
    • Publication date Dec 18, 2003
    • Shiro Yamashita
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Method for removing solder bumps from LSI
    • Publication number 20030034380
    • Publication date Feb 20, 2003
    • Hitachi, Ltd
    • Motoko Kimura
    • Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC