Shirou Murai

Person

Kanagawa, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Working apparatus
- Patent number 6,722,956
- Issue date Apr 20, 2004
- Nippei Toyama Corporation
- Tetsuo Okuyama
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus and method of chamfering wafer
- Patent number 6,439,969
- Issue date Aug 27, 2002
- Nippei Toyama Corporation
- Kikuo Koma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for grinding a workpiece
- Patent number 6,332,834
- Issue date Dec 25, 2001
- Nippei Toyama Corporation
- Mitsuru Nukui
- B24 - GRINDING POLISHING
Information Patent Grant
Method for chamfering a wafer
- Patent number 6,302,769
- Issue date Oct 16, 2001
- Nippei Toyama Corporation
- Kenichiro Nishi
- B24 - GRINDING POLISHING
Information Patent Grant
Grinding method, surface grinder, workpiece support, mechanism and...
- Patent number 6,296,553
- Issue date Oct 2, 2001
- Nippei Toyama Corporation
- Kenichiro Nishi
- B24 - GRINDING POLISHING
Information Patent Grant
Feeding a grinding wheel in grinding method
- Patent number 6,220,931
- Issue date Apr 24, 2001
- Nippei Toyama Corporation
- Kenichiro Nishi
- B24 - GRINDING POLISHING
Information Patent Grant
Ingot slicing method, an ingot manufacturing method and a sliced in...
- Patent number 6,113,489
- Issue date Sep 5, 2000
- Nippei Toyama Corporation
- Kenichiro Nishi
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Grinder and grinding method
- Patent number 6,036,585
- Issue date Mar 14, 2000
- Nippei Toyama Corporation
- Kenichiro Nishi
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
HORIZONTAL MACHINE TOOL
- Publication number 20120020755
- Publication date Jan 26, 2012
- Komatsu NTC Ltd.
- Koji Hiroshima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR CHAMFERING A WAFER
- Publication number 20010041513
- Publication date Nov 15, 2001
- NISHI AND MURAI
- KENICHIRO NISHI
- B24 - GRINDING POLISHING
Information Patent Application
Working apparatus
- Publication number 20010006880
- Publication date Jul 5, 2001
- Tetsuo Okuyama
- B24 - GRINDING POLISHING

Shirou Murai

Person

Patents Grantslast 30 patents

Working apparatus

Apparatus and method of chamfering wafer

Method and apparatus for grinding a workpiece

Method for chamfering a wafer

Grinding method, surface grinder, workpiece support, mechanism and...

Feeding a grinding wheel in grinding method

Ingot slicing method, an ingot manufacturing method and a sliced in...

Grinder and grinding method

Patents Applicationslast 30 patents

HORIZONTAL MACHINE TOOL

METHOD FOR CHAMFERING A WAFER

Working apparatus