Shiu-Ko JiangJian

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Tainan City, TW

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Patents Applicationslast 30 patents

Information Patent Application
SOFT MATERIAL WAFER BONDING AND METHOD OF BONDING
- Publication number 20130207098
- Publication date Aug 15, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tung-Ti YEH
- H01 - BASIC ELECTRIC ELEMENTS