Shiuh-Hui Steven Chen

Person

Lake Zurich, IL, US

People

Patents Grantslast 30 patents

Information Patent Grant
Mems pressure sensing element with stress adjustors to minimize the...
- Patent number 11,573,143
- Issue date Feb 7, 2023
- Vitesco Technologies USA, LLC.
- Jen-Huang Albert Chiou
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
CSOI MEMS pressure sensing element with stress equalizers
- Patent number 11,029,227
- Issue date Jun 8, 2021
- Vitesco Technologies USA, LLC.
- Jen-Huang Albert Chiou
- G01 - MEASURING TESTING
Information Patent Grant
Cavity with silicon on insulator MEMS pressure sensing device with...
- Patent number 10,221,062
- Issue date Mar 5, 2019
- Continental Automotive Systems, Inc.
- Jen-Huang Albert Chiou
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stress-isolated absolute pressure sensor
- Patent number 10,060,820
- Issue date Aug 28, 2018
- Continental Automotive Systems, Inc.
- Shiuh-Hui Steven Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Pressure sensor device with anchors for die shrinkage and high sens...
- Patent number 9,964,458
- Issue date May 8, 2018
- Continental Automotive Systems, Inc.
- Jen-Huang Albert Chiou
- G01 - MEASURING TESTING
Information Patent Grant
Symmetrical piezoresistive pressure sensor with stacking ICs
- Patent number 9,846,096
- Issue date Dec 19, 2017
- Continental Automotive Systems, Inc.
- Shiuh-Hui Steven Chen
- G01 - MEASURING TESTING
Information Patent Grant
3D stacked piezoresistive pressure sensor
- Patent number 9,846,095
- Issue date Dec 19, 2017
- Continental Automotive Systems, Inc.
- Jen-Huang Albert Chiou
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Piezoresistive pressure sensor device
- Patent number 9,764,947
- Issue date Sep 19, 2017
- Continental Automotive Systems, Inc.
- Jen-Huang Albert Chiou
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Pressure sensor device with high sensitivity and high accuracy
- Patent number 9,651,441
- Issue date May 16, 2017
- Continental Automotive Systems, Inc.
- Jen-Huang Albert Chiou
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Piezoresistive transducer with low thermal noise
- Patent number 9,395,259
- Issue date Jul 19, 2016
- Continental Automotive Systems, Inc.
- Jen-Huang Albert Chiou
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor sensing device to minimize thermal noise
- Patent number 8,881,596
- Issue date Nov 11, 2014
- Continental Automotive Systems, Inc.
- Jen-Huang Albert Chiou
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Robust design of high pressure sensor device
- Patent number 8,302,483
- Issue date Nov 6, 2012
- Continental Automotive Systems, Inc.
- Jen-Huang Albert Chiou
- G01 - MEASURING TESTING
Information Patent Grant
Grooved structure for die-mount and media sealing
- Patent number 8,191,423
- Issue date Jun 5, 2012
- Continental Automotive Systems, Inc.
- Jen-Huang Albert Chiou
- G01 - MEASURING TESTING
Information Patent Grant
Low pressure sensor device with high accuracy and high sensitivity
- Patent number 7,997,142
- Issue date Aug 16, 2011
- Continental Automotive Systems, Inc.
- Jen-Huang Albert Chiou
- G01 - MEASURING TESTING
Information Patent Grant
Capacitive accelerometer or acceleration switch
- Patent number 7,180,019
- Issue date Feb 20, 2007
- Temic Automotive of North America, Inc.
- Jen-Huang A. Chiou
- G01 - MEASURING TESTING
Information Patent Grant
Acceleration switch
- Patent number 7,009,124
- Issue date Mar 7, 2006
- Motorola, Inc.
- Shiuh-Hui Steven Chen
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor wafer having a thin die and tethers and methods of ma...
- Patent number 6,881,648
- Issue date Apr 19, 2005
- Motorola, Inc.
- Shiuh-Hui Steven Chen
- G01 - MEASURING TESTING
Information Patent Grant
Method of separating and handling a thin semiconductor die on a wafer
- Patent number 6,772,509
- Issue date Aug 10, 2004
- Motorola, Inc.
- Shiuh-Hui Steven Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor wafer having a thin die and tethers and methods of ma...
- Patent number 6,608,370
- Issue date Aug 19, 2003
- Motorola, Inc.
- Shiuh-Hui Steven Chen
- G01 - MEASURING TESTING
Information Patent Grant
Strain gauge
- Patent number 6,427,539
- Issue date Aug 6, 2002
- Motorola, Inc.
- Shiuh-Hui Steven Chen
- G01 - MEASURING TESTING
Information Patent Grant
Capacitive pressure sensor and method of fabricating same
- Patent number 5,744,725
- Issue date Apr 28, 1998
- Motorola Inc.
- Shiuh-Hui Steven Chen
- G01 - MEASURING TESTING
Information Patent Grant
Capacitive pressure sensor and method for making the same
- Patent number 5,600,072
- Issue date Feb 4, 1997
- Motorola, Inc.
- Shiuh-Hui S. Chen
- G01 - MEASURING TESTING
Information Patent Grant
Device with bonded conductive and insulating substrates and method...
- Patent number 5,365,790
- Issue date Nov 22, 1994
- Motorola, Inc.
- Shiuh-Hui Chen
- G01 - MEASURING TESTING
Information Patent Grant
Hermetically sealed interface
- Patent number 5,173,836
- Issue date Dec 22, 1992
- Motorola, Inc.
- Joseph P. Tomase
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
Mems Pressure Sensing Element with Stress Adjustors to Minimize The...
- Publication number 20220341799
- Publication date Oct 27, 2022
- Vitesco Technologies USA, LLC
- Jen-Huang Albert Chiou
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CSOI MEMS PRESSURE SENSING ELEMENT WITH STRESS EQUALIZERS
- Publication number 20190368956
- Publication date Dec 5, 2019
- CONTINENTAL AUTOMOTIVE SYSTEMS, INC.
- Jen-Huang Albert Chiou
- G01 - MEASURING TESTING
Information Patent Application
CAVITY WITH SILICON ON INSULATOR MEMS PRESSURE SENSING DEVICE WITH...
- Publication number 20180093881
- Publication date Apr 5, 2018
- CONTINENTAL AUTOMOTIVE SYSTEMS, INC.
- Jen-Huang Albert Chiou
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PRESSURE SENSOR DEVICE WITH ANCHORS FOR DIE SHRINKAGE AND HIGH SENS...
- Publication number 20170328797
- Publication date Nov 16, 2017
- CONTINENTAL AUTOMOTIVE SYSTEMS, INC.
- Jen-Huang Albert Chiou
- G01 - MEASURING TESTING
Information Patent Application
STRESS-ISOLATED ABSOLUTE PRESSURE SENSOR
- Publication number 20170176278
- Publication date Jun 22, 2017
- CONTINENTAL AUTOMOTIVE SYSTEMS, INC.
- Shiuh-Hui Steven Chen
- G01 - MEASURING TESTING
Information Patent Application
3D STACKED PIEZORESISTIVE PRESSURE SENSOR
- Publication number 20160320255
- Publication date Nov 3, 2016
- CONTINENTAL AUTOMOTIVE SYSTEMS, INC.
- Jen-Huang Albert Chiou
- G01 - MEASURING TESTING
Information Patent Application
SYMMETRICAL PIEZORESISTIVE PRESSURE SENSOR WITH STACKING ICs
- Publication number 20160299025
- Publication date Oct 13, 2016
- CONTINENTAL AUTOMOTIVE SYSTEMS, INC.
- Shiuh-Hui Steven Chen
- G01 - MEASURING TESTING
Information Patent Application
PIEZORESISTIVE PRESSURE SENSOR DEVICE
- Publication number 20160146685
- Publication date May 26, 2016
- CONTINENTAL AUTOMOTIVE SYSTEMS, INC.
- Jen-Huang Albert Chiou
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PRESSURE SENSOR DEVICE WITH HIGH SENSITIVITY AND HIGH ACCURACY
- Publication number 20150330856
- Publication date Nov 19, 2015
- CONTINENTAL AUTOMOTIVE SYSTEMS, INC.
- Jen-Huang Albert Chiou
- G01 - MEASURING TESTING
Information Patent Application
PIEZORESISTIVE TRANSDUCER WITH LOW THERMAL NOISE
- Publication number 20140137653
- Publication date May 22, 2014
- Jen-Huang Albert Chiou
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR SENSING DEVICE TO MINIMIZE THERMAL NOISE
- Publication number 20130192378
- Publication date Aug 1, 2013
- CONTINENTAL AUTOMOTIVE SYSTEMS, INC.
- Jen-Huang Albert Chiou
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ROBUST DESIGN OF HIGH PRESSURE SENSOR DEVICE
- Publication number 20120216622
- Publication date Aug 30, 2012
- CONTINENTAL AUTOMOTIVE SYSTEMS, INC.
- Jen-Huang Albert Chiou
- G01 - MEASURING TESTING
Information Patent Application
Grooved Structure For Die-Mount And Media Sealing
- Publication number 20110232389
- Publication date Sep 29, 2011
- CONTINENTAL AUTOMOTIVE SYSTEMS, INC.
- Jen-Huang Albert Chiou
- G01 - MEASURING TESTING
Information Patent Application
LOW PRESSURE SENSOR DEVICE WITH HIGH ACCURACY AND HIGH SENSITIVITY
- Publication number 20110023618
- Publication date Feb 3, 2011
- TEMIC AUTOMOTIVE OF NORTH AMERICA, INC.
- JEN-HUANG ALBERT CHIOU
- G01 - MEASURING TESTING
Information Patent Application
ACCELERATION SWITCH
- Publication number 20050252755
- Publication date Nov 17, 2005
- Shiuh-Hui Steven Chen
- B60 - VEHICLES IN GENERAL
Information Patent Application
Semiconductor wafer having a thin die and tethers and methods of ma...
- Publication number 20030162322
- Publication date Aug 28, 2003
- Shiuh-Hui Steven Chen
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR WAFER HAVING A THIN DIE AND TETHERS AND METHODS OF MA...
- Publication number 20030141570
- Publication date Jul 31, 2003
- Shiuh-Hui Steven Chen
- G01 - MEASURING TESTING
Information Patent Application
Method of separating and handling a thin semiconductor die on a wafer
- Publication number 20030140486
- Publication date Jul 31, 2003
- Shiuh-Hui Steven Chen
- G06 - COMPUTING CALCULATING COUNTING

Shiuh-Hui Steven Chen

Person

Patents Grantslast 30 patents

Mems pressure sensing element with stress adjustors to minimize the...

CSOI MEMS pressure sensing element with stress equalizers

Cavity with silicon on insulator MEMS pressure sensing device with...

Stress-isolated absolute pressure sensor

Pressure sensor device with anchors for die shrinkage and high sens...

Symmetrical piezoresistive pressure sensor with stacking ICs

3D stacked piezoresistive pressure sensor

Piezoresistive pressure sensor device

Pressure sensor device with high sensitivity and high accuracy

Piezoresistive transducer with low thermal noise

Semiconductor sensing device to minimize thermal noise

Robust design of high pressure sensor device

Grooved structure for die-mount and media sealing

Low pressure sensor device with high accuracy and high sensitivity

Capacitive accelerometer or acceleration switch

Acceleration switch

Semiconductor wafer having a thin die and tethers and methods of ma...

Method of separating and handling a thin semiconductor die on a wafer

Semiconductor wafer having a thin die and tethers and methods of ma...

Strain gauge

Capacitive pressure sensor and method of fabricating same

Capacitive pressure sensor and method for making the same

Device with bonded conductive and insulating substrates and method...

Hermetically sealed interface

Patents Applicationslast 30 patents

Mems Pressure Sensing Element with Stress Adjustors to Minimize The...

CSOI MEMS PRESSURE SENSING ELEMENT WITH STRESS EQUALIZERS

CAVITY WITH SILICON ON INSULATOR MEMS PRESSURE SENSING DEVICE WITH...

PRESSURE SENSOR DEVICE WITH ANCHORS FOR DIE SHRINKAGE AND HIGH SENS...

STRESS-ISOLATED ABSOLUTE PRESSURE SENSOR

3D STACKED PIEZORESISTIVE PRESSURE SENSOR

SYMMETRICAL PIEZORESISTIVE PRESSURE SENSOR WITH STACKING ICs

PIEZORESISTIVE PRESSURE SENSOR DEVICE

PRESSURE SENSOR DEVICE WITH HIGH SENSITIVITY AND HIGH ACCURACY

PIEZORESISTIVE TRANSDUCER WITH LOW THERMAL NOISE

SEMICONDUCTOR SENSING DEVICE TO MINIMIZE THERMAL NOISE

ROBUST DESIGN OF HIGH PRESSURE SENSOR DEVICE

Grooved Structure For Die-Mount And Media Sealing

LOW PRESSURE SENSOR DEVICE WITH HIGH ACCURACY AND HIGH SENSITIVITY

ACCELERATION SWITCH

Semiconductor wafer having a thin die and tethers and methods of ma...

SEMICONDUCTOR WAFER HAVING A THIN DIE AND TETHERS AND METHODS OF MA...

Method of separating and handling a thin semiconductor die on a wafer