Shivasubramanian Balasubramanian

Person

Gilbert, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Magnetic material having coated ferromagnetic filler particles
- Patent number 11,728,077
- Issue date Aug 15, 2023
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective deposition of embedded thin-film resistors for semiconduc...
- Patent number 11,728,265
- Issue date Aug 15, 2023
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package including a capacitor
- Patent number 11,652,071
- Issue date May 16, 2023
- Intel Corporation
- Brandon C Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-embedded thin-film capacitors, package-integral magnetic in...
- Patent number 11,637,171
- Issue date Apr 25, 2023
- Intel Corporation
- Shivasubramanian Balasubramanian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic material having coated ferromagnetic filler particles
- Patent number 11,158,444
- Issue date Oct 26, 2021
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package including a capacitor
- Patent number 10,923,443
- Issue date Feb 16, 2021
- Intel Corporation
- Brandon C Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-embedded thin-film capacitors, package-integral magnetic in...
- Patent number 10,756,161
- Issue date Aug 25, 2020
- Intel Corporation
- Shivasubramanian Balasubramanian
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MAGNETIC MATERIAL HAVING COATED FERROMAGNETIC FILLER PARTICLES
- Publication number 20220005638
- Publication date Jan 6, 2022
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGE INCLUDING A CAPACITOR
- Publication number 20210151393
- Publication date May 20, 2021
- Intel Corporation
- Brandon C Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-EMBEDDED THIN-FILM CAPACITORS, PACKAGE-INTEGRAL MAGNETIC IN...
- Publication number 20200350396
- Publication date Nov 5, 2020
- Intel Corporation
- Shivasubramanian Balasubramanian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGE INCLUDING A CAPACITOR
- Publication number 20200312793
- Publication date Oct 1, 2020
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE DEPOSITION OF EMBEDDED THIN-FILM RESISTORS FOR SEMICONDUC...
- Publication number 20200083164
- Publication date Mar 12, 2020
- Intel Corporation
- Brandon C. MARIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-EMBEDDED THIN-FILM CAPACITORS, PACKAGE-INTEGRAL MAGNETIC IN...
- Publication number 20200006463
- Publication date Jan 2, 2020
- Intel Corporation
- Shivasubramanian Balasubramanian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC MATERIAL HAVING COATED FERROMAGNETIC FILLER PARTICLES
- Publication number 20190252102
- Publication date Aug 15, 2019
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS

Shivasubramanian Balasubramanian

Person

Patents Grantslast 30 patents

Magnetic material having coated ferromagnetic filler particles

Selective deposition of embedded thin-film resistors for semiconduc...

Electronic device package including a capacitor

Package-embedded thin-film capacitors, package-integral magnetic in...

Magnetic material having coated ferromagnetic filler particles

Electronic device package including a capacitor

Package-embedded thin-film capacitors, package-integral magnetic in...

Patents Applicationslast 30 patents

MAGNETIC MATERIAL HAVING COATED FERROMAGNETIC FILLER PARTICLES

ELECTRONIC DEVICE PACKAGE INCLUDING A CAPACITOR

PACKAGE-EMBEDDED THIN-FILM CAPACITORS, PACKAGE-INTEGRAL MAGNETIC IN...

ELECTRONIC DEVICE PACKAGE INCLUDING A CAPACITOR

SELECTIVE DEPOSITION OF EMBEDDED THIN-FILM RESISTORS FOR SEMICONDUC...

PACKAGE-EMBEDDED THIN-FILM CAPACITORS, PACKAGE-INTEGRAL MAGNETIC IN...

MAGNETIC MATERIAL HAVING COATED FERROMAGNETIC FILLER PARTICLES