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Shizue Ogawa
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Toyama, JP
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last 30 patents
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Patent Grant
Substrate processing apparatus
Patent number
8,518,182
Issue date
Aug 27, 2013
Hitachi Kokusai Electric Inc.
Shizue Ogawa
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Substrate processing apparatus
Patent number
7,958,842
Issue date
Jun 14, 2011
Hitachi Kokusai Electric Inc.
Shizue Ogawa
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Patents Applications
last 30 patents
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Patent Application
SUBSTRATE PROCESSING APPARATUS
Publication number
20110209664
Publication date
Sep 1, 2011
Shizue Ogawa
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
Substrate Processing Apparatus
Publication number
20080153308
Publication date
Jun 26, 2008
Hitachi Kokusai Electric Inc.
Shizue Ogawa
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...