Shizue Ogawa

Person

  • Toyama, JP

Patents Grantslast 30 patents

  • Information Patent Grant

    Substrate processing apparatus

    • Patent number 8,518,182
    • Issue date Aug 27, 2013
    • Hitachi Kokusai Electric Inc.
    • Shizue Ogawa
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Substrate processing apparatus

    • Patent number 7,958,842
    • Issue date Jun 14, 2011
    • Hitachi Kokusai Electric Inc.
    • Shizue Ogawa
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

  • Information Patent Application

    SUBSTRATE PROCESSING APPARATUS

    • Publication number 20110209664
    • Publication date Sep 1, 2011
    • Shizue Ogawa
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    Substrate Processing Apparatus

    • Publication number 20080153308
    • Publication date Jun 26, 2008
    • Hitachi Kokusai Electric Inc.
    • Shizue Ogawa
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...