Shizuki Hashimoto

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Asa, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package using an aluminum nitride substrate
- Patent number 5,463,248
- Issue date Oct 31, 1995
- Kabushiki Kaisha Toshiba
- Keiichi Yano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lid for semiconductor package and package having the lid
- Patent number 5,414,300
- Issue date May 9, 1995
- Sumitomo Metal Ceramics Inc.
- Yoji Tozawa
- H01 - BASIC ELECTRIC ELEMENTS