Shle-Ge Lee

Person

Seoul, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor module heatspreading lid having integrated separators...
- Patent number 11,776,866
- Issue date Oct 3, 2023
- Samsung Electronics Co., Ltd.
- Shle-Ge Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film package and method of fabricating package module
- Patent number 11,527,470
- Issue date Dec 13, 2022
- Samsung Electronics Co., Ltd.
- Shle-Ge Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board including warpage offset regions and semicond...
- Patent number 11,140,772
- Issue date Oct 5, 2021
- Samsung Electronics Co., Ltd.
- Shle-Ge Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,024,568
- Issue date Jun 1, 2021
- Samsung Electronics Co., Ltd.
- Shle Ge Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board, semiconductor package including the printed...
- Patent number 10,672,694
- Issue date Jun 2, 2020
- Samsung Electronics Co., Ltd.
- Dong-suk Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board including warpage offset regions and semicond...
- Patent number 10,506,706
- Issue date Dec 10, 2019
- Samsung Electronics Co., Ltd.
- Shle-Ge Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 9,728,497
- Issue date Aug 8, 2017
- Samsung Electronics Co., Ltd.
- Yu-duk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 8,427,841
- Issue date Apr 23, 2013
- Samsung Electronics Co., Ltd.
- Dong-Kil Shin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device having a conductive bump
- Patent number 8,120,176
- Issue date Feb 21, 2012
- Samsung Electronics Co., Ltd.
- Dong-Kil Shin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE COMPRISING STIFFENER AND SCREW
- Publication number 20250022772
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Insik HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING AN EDGE REGION HAVING A PLURALITY O...
- Publication number 20240234274
- Publication date Jul 11, 2024
- Samsung Electronics Co., Ltd.
- Tong Suk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240222348
- Publication date Jul 4, 2024
- Samsung Electronics Co., Ltd.
- Seunggeol RYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240203958
- Publication date Jun 20, 2024
- Samsung Electronics Co., Ltd.
- SHLE-GE LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE INCLUDING A HEAT RADIATION STRUCTURE
- Publication number 20210183724
- Publication date Jun 17, 2021
- Samsung Electronics Co., Ltd.
- SHLE-GE LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM PACKAGE AND METHOD OF FABRICATING PACKAGE MODULE
- Publication number 20210104452
- Publication date Apr 8, 2021
- Samsung Electronics Co., Ltd.
- SHLE-GE LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND A SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20200126899
- Publication date Apr 23, 2020
- Samsung Electronics Co., Ltd.
- Shle Ge LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD INCLUDING WARPAGE OFFSET REGIONS AND SEMICOND...
- Publication number 20200092989
- Publication date Mar 19, 2020
- Samsung Electronics Co., Ltd.
- Shle-Ge Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20200043837
- Publication date Feb 6, 2020
- Samsung Electronics Co., Ltd.
- Shle Ge LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD INCLUDING WARPAGE OFFESET REGIONS AND SEMICON...
- Publication number 20190124761
- Publication date Apr 25, 2019
- Samsung Electronics Co., Ltd.
- Shle-Ge Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image Sensor Modules Having Support Structures
- Publication number 20190082084
- Publication date Mar 14, 2019
- Samsung Electronics Co., Ltd.
- Shle Ge Lee
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PRINTED CIRCUIT BOARD, SEMICONDUCTOR PACKAGE INCLUDING THE PRINTED...
- Publication number 20170207155
- Publication date Jul 20, 2017
- Samsung Electronics Co., Ltd.
- Dong-suk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20170011992
- Publication date Jan 12, 2017
- Samsung Electronics Co., Ltd.
- Yu-duk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic device
- Publication number 20100259912
- Publication date Oct 14, 2010
- SAMSUNG ELECTRONICS CO., LTD.
- Dong-Kil Shin
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A CONDUCTIVE BUMP
- Publication number 20100230811
- Publication date Sep 16, 2010
- Dong-Kil Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device package
- Publication number 20080122056
- Publication date May 29, 2008
- Samsung Electronics Co., Ltd.
- Shle-Ge Lee
- H01 - BASIC ELECTRIC ELEMENTS

Shle-Ge Lee

Person

Patents Grantslast 30 patents

Semiconductor module heatspreading lid having integrated separators...

Film package and method of fabricating package module

Printed circuit board including warpage offset regions and semicond...

Semiconductor package

Printed circuit board, semiconductor package including the printed...

Printed circuit board including warpage offset regions and semicond...

Semiconductor device and method of manufacturing the same

Electronic device

Semiconductor device having a conductive bump

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE COMPRISING STIFFENER AND SCREW

SEMICONDUCTOR PACKAGE INCLUDING AN EDGE REGION HAVING A PLURALITY O...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR MODULE INCLUDING A HEAT RADIATION STRUCTURE

FILM PACKAGE AND METHOD OF FABRICATING PACKAGE MODULE

PRINTED CIRCUIT BOARD AND A SEMICONDUCTOR PACKAGE INCLUDING THE SAME

PRINTED CIRCUIT BOARD INCLUDING WARPAGE OFFSET REGIONS AND SEMICOND...

SEMICONDUCTOR PACKAGE

PRINTED CIRCUIT BOARD INCLUDING WARPAGE OFFESET REGIONS AND SEMICON...

Image Sensor Modules Having Support Structures

PRINTED CIRCUIT BOARD, SEMICONDUCTOR PACKAGE INCLUDING THE PRINTED...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Electronic device

SEMICONDUCTOR DEVICE HAVING A CONDUCTIVE BUMP

Semiconductor device package