Sho Akai

Person

Ibi-gun, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Multilayer printed wiring board and method for manufacturing multil...
- Patent number 9,038,266
- Issue date May 26, 2015
- Ibiden Co., Ltd.
- Sho Akai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing multilayer printed wiring board
- Patent number 8,683,685
- Issue date Apr 1, 2014
- Ibiden Co., Ltd.
- Toru Nakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing multilayer printed wiring board
- Patent number 8,661,665
- Issue date Mar 4, 2014
- Ibiden Co., Ltd.
- Sho Akai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board and method for manufacturing multil...
- Patent number 8,633,400
- Issue date Jan 21, 2014
- Ibiden Co., Ltd.
- Sho Akai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing multilayer printed wiring board
- Patent number 8,499,446
- Issue date Aug 6, 2013
- Ibiden Co., Ltd.
- Toru Nakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board and method of manufacturing multila...
- Patent number 8,314,348
- Issue date Nov 20, 2012
- Ibiden Co., Ltd.
- Toru Nakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board and method for manufacturing multil...
- Patent number 8,314,340
- Issue date Nov 20, 2012
- Ibiden Co., Ltd.
- Sho Akai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method and manufacturing apparatus of printed wiring...
- Patent number 7,823,762
- Issue date Nov 2, 2010
- Ibiden Co., Ltd.
- Yoichiro Kawamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MULTILAYER PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING MULTIL...
- Publication number 20120082779
- Publication date Apr 5, 2012
- IBIDEN CO., LTD.
- Sho AKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING MULTIL...
- Publication number 20120080400
- Publication date Apr 5, 2012
- IBIDEN CO., LTD.
- Sho AKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER PRINTED WIRING BOARD AND METHOD OF MANUFACTURING MULTILA...
- Publication number 20110296682
- Publication date Dec 8, 2011
- IBIDEN CO., LTD.
- Toru Nakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING MULTILAYER PRINTED WIRING BOARD
- Publication number 20110272286
- Publication date Nov 10, 2011
- IBIDEN CO., LTD.
- Toru Nakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING MULTIL...
- Publication number 20100126758
- Publication date May 27, 2010
- IBIDEN, CO,. LTD.
- Sho AKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING MULTIL...
- Publication number 20100122839
- Publication date May 20, 2010
- IBIDEN, CO., LTD.
- Sho AKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING MULTILAYER PRINTED WIRING BOARD
- Publication number 20090218119
- Publication date Sep 3, 2009
- IBIDEN CO., LTD.
- Toru Nakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER PRINTED WIRING BOARD AND METHOD OF MANUFACTURING MULTILA...
- Publication number 20090218125
- Publication date Sep 3, 2009
- IBIDEN CO., LTD.
- Toru Nakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Manufacturing method and manufacturing apparatus of printed wiring...
- Publication number 20080078810
- Publication date Apr 3, 2008
- IBIDEN CO., LTD.
- Yoichiro Kawamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Person

Patents Grantslast 30 patents

Multilayer printed wiring board and method for manufacturing multil...

Method of manufacturing multilayer printed wiring board

Method for manufacturing multilayer printed wiring board

Multilayer printed wiring board and method for manufacturing multil...

Method of manufacturing multilayer printed wiring board

Multilayer printed wiring board and method of manufacturing multila...

Multilayer printed wiring board and method for manufacturing multil...

Manufacturing method and manufacturing apparatus of printed wiring...

Patents Applicationslast 30 patents

MULTILAYER PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING MULTIL...

MULTILAYER PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING MULTIL...

MULTILAYER PRINTED WIRING BOARD AND METHOD OF MANUFACTURING MULTILA...

METHOD OF MANUFACTURING MULTILAYER PRINTED WIRING BOARD

MULTILAYER PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING MULTIL...

MULTILAYER PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING MULTIL...

METHOD OF MANUFACTURING MULTILAYER PRINTED WIRING BOARD

MULTILAYER PRINTED WIRING BOARD AND METHOD OF MANUFACTURING MULTILA...

Manufacturing method and manufacturing apparatus of printed wiring...