Sho FUJITA

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Nagaokakyo-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor composite device and package board used therein
- Patent number 11,552,020
- Issue date Jan 10, 2023
- Murata Manufacturing Co., Ltd.
- Koshi Himeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor composite device and package board used therein
- Patent number 11,121,123
- Issue date Sep 14, 2021
- Murata Manufacturing Co., Ltd.
- Koshi Himeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component module and method for manufacturing electronic...
- Patent number 9,860,989
- Issue date Jan 2, 2018
- Murata Manufacturing Co., Ltd.
- Shinya Kiyono
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CONNECTION STRUCTURE AND CONNECTION STRUCTURE MANUFACTURING METHOD
- Publication number 20230262895
- Publication date Aug 17, 2023
- Murata Manufacturing Co., Ltd.
- Yuma OTSUKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR COMPOSITE DEVICE AND PACKAGE BOARD USED THEREIN
- Publication number 20210375841
- Publication date Dec 2, 2021
- Murata Manufacturing Co., Ltd.
- Koshi Himeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPOSITE DEVICE AND PACKAGE BOARD USED THEREIN
- Publication number 20200321323
- Publication date Oct 8, 2020
- Murata Manufacturing Co., Ltd.
- Koshi Himeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MODULE AND METHOD FOR MANUFACTURING ELECTRONIC...
- Publication number 20160338201
- Publication date Nov 17, 2016
- Murata Manufacturing Co., Ltd.
- Shinya KIYONO
- H01 - BASIC ELECTRIC ELEMENTS