Sho KAWADAHARA

Person

Yokkaichi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Substrate bonding apparatus and method of manufacturing a semicondu...
- Patent number 12,002,700
- Issue date Jun 4, 2024
- Kioxia Corporation
- Sho Kawadahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing apparatus and semiconductor manufacturi...
- Patent number 11,984,328
- Issue date May 14, 2024
- Kioxia Corporation
- Sho Kawadahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing apparatus, operation method thereof, and method for m...
- Patent number 11,791,305
- Issue date Oct 17, 2023
- Kioxia Corporation
- Sho Kawadahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate bonding apparatus, manufacturing system, and semiconducto...
- Patent number 11,776,931
- Issue date Oct 3, 2023
- Kioxia Corporation
- Sho Kawadahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Registration mark, positional deviation detection method and device...
- Patent number 11,646,239
- Issue date May 9, 2023
- Kioxia Corporation
- Sho Kawadahara
- G01 - MEASURING TESTING
Information Patent Grant
Wafer separating method
- Patent number 11,551,934
- Issue date Jan 10, 2023
- Kioxia Corporation
- Sho Kawadahara
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Semiconductor manufacturing apparatus and method of manufacturing s...
- Patent number 11,275,310
- Issue date Mar 15, 2022
- Kioxia Corporation
- Sho Kawadahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate bonding apparatus, substrate pairing apparatus, and semic...
- Patent number 11,148,938
- Issue date Oct 19, 2021
- TOSHIBA MEMORY CORPORATION
- Sho Kawadahara
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Pattern forming apparatus and manufacturing method for semiconducto...
- Patent number 10,510,569
- Issue date Dec 17, 2019
- TOSHIBA MEMORY CORPORATION
- Sho Kawadahara
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR MANUFACTURING DEVICE, AND SEPARATING MEMBER
- Publication number 20240321604
- Publication date Sep 26, 2024
- KIOXIA Corporation
- Sho KAWADAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REGISTRATION MARK, POSITIONAL DEVIATION DETECTION METHOD AND DEVICE...
- Publication number 20220293478
- Publication date Sep 15, 2022
- KIOXIA Corporation
- Sho KAWADAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR MANUFACTURI...
- Publication number 20220285176
- Publication date Sep 8, 2022
- KIOXIA Corporation
- Sho KAWADAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING APPARATUS, OPERATION METHOD THEREOF, AND METHOD FOR M...
- Publication number 20220262764
- Publication date Aug 18, 2022
- KIOXIA Corporation
- Sho KAWADAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING APPARATUS AND METHOD OF MANUFACTURING A SEMICONDU...
- Publication number 20220076980
- Publication date Mar 10, 2022
- KIOXIA Corporation
- Sho KAWADAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER SEPARATING APPARATUS AND WAFER SEPARATING METHOD
- Publication number 20210276815
- Publication date Sep 9, 2021
- Kioxia Corporation
- Sho KAWADAHARA
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING S...
- Publication number 20210278770
- Publication date Sep 9, 2021
- KIOXIA Corporation
- Sho KAWADAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING APPARATUS, MANUFACTURING SYSTEM, AND SEMICONDUCTO...
- Publication number 20210074670
- Publication date Mar 11, 2021
- Kioxia Corporation
- Sho KAWADAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING APPARATUS, SUBSTRATE PAIRING APPARATUS, AND SEMIC...
- Publication number 20200286853
- Publication date Sep 10, 2020
- Toshiba Memory Corporation
- Sho KAWADAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERN FORMING APPARATUS AND MANUFACTURING METHOD FOR SEMICONDUCTO...
- Publication number 20190221461
- Publication date Jul 18, 2019
- Toshiba Memory Corporation
- Sho KAWADAHARA
- H01 - BASIC ELECTRIC ELEMENTS

Sho KAWADAHARA

Person

Patents Grantslast 30 patents

Substrate bonding apparatus and method of manufacturing a semicondu...

Semiconductor manufacturing apparatus and semiconductor manufacturi...

Manufacturing apparatus, operation method thereof, and method for m...

Substrate bonding apparatus, manufacturing system, and semiconducto...

Registration mark, positional deviation detection method and device...

Wafer separating method

Semiconductor manufacturing apparatus and method of manufacturing s...

Substrate bonding apparatus, substrate pairing apparatus, and semic...

Pattern forming apparatus and manufacturing method for semiconducto...

Patents Applicationslast 30 patents

SEMICONDUCTOR MANUFACTURING DEVICE, AND SEPARATING MEMBER

REGISTRATION MARK, POSITIONAL DEVIATION DETECTION METHOD AND DEVICE...

SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR MANUFACTURI...

MANUFACTURING APPARATUS, OPERATION METHOD THEREOF, AND METHOD FOR M...

SUBSTRATE BONDING APPARATUS AND METHOD OF MANUFACTURING A SEMICONDU...

WAFER SEPARATING APPARATUS AND WAFER SEPARATING METHOD

SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING S...

SUBSTRATE BONDING APPARATUS, MANUFACTURING SYSTEM, AND SEMICONDUCTO...

SUBSTRATE BONDING APPARATUS, SUBSTRATE PAIRING APPARATUS, AND SEMIC...

PATTERN FORMING APPARATUS AND MANUFACTURING METHOD FOR SEMICONDUCTO...