Shoa Siong Lim

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structure and semiconductor package device using the...
- Patent number 10,763,133
- Issue date Sep 1, 2020
- Advanpack Solutions PTE LTD
- Jimmy Hwee-Seng Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor package
- Patent number 10,154,588
- Issue date Dec 11, 2018
- Advanpack Solutions PTE LTD
- Hwee-Seng Jimmy Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor package device
- Patent number 10,109,503
- Issue date Oct 23, 2018
- Advanpack Solutions PTE LTD
- Jimmy Hwee-Seng Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of package substrate and package manufacturing...
- Patent number 9,892,916
- Issue date Feb 13, 2018
- Advanpack Solutions PTE LTD
- Shoa-Siong Raymond Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 9,847,268
- Issue date Dec 19, 2017
- Advanpack Solutions Pte. Ltd.
- Shoa Siong Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of fabricating the same
- Patent number 9,754,899
- Issue date Sep 5, 2017
- Advanpack Solutions PTE LTD
- Shoa Siong Raymond Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structure, semiconductor package device, and manufacturin...
- Patent number 9,723,717
- Issue date Aug 1, 2017
- Advanpack Solutions PTE LTD
- Hwee-Seng Jimmy Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of substrate structure having embedded interco...
- Patent number 9,653,323
- Issue date May 16, 2017
- Advanpack Solutions PTE LTD
- Hwee-Seng Jimmy Chew
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor package
- Patent number 9,583,449
- Issue date Feb 28, 2017
- Advanpack Solutions PTE LTD
- Hwee-Seng Jimmy Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package carrier, package carrier manufacturing method, package stru...
- Patent number 9,379,044
- Issue date Jun 28, 2016
- Advanpack Solutions PTE LTD
- Shoa-Siong Raymond Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of forming an etch-back type semiconductor pac...
- Patent number 9,305,868
- Issue date Apr 5, 2016
- Advanpack Solutions PTE LTD
- Hwee-Seng Jimmy Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structure, semiconductor package device, and manufacturin...
- Patent number 9,301,391
- Issue date Mar 29, 2016
- Advanpack Solutions PTE LTD
- Hwee-Seng Jimmy Chew
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device carrier and semiconductor package using the same
- Patent number 9,219,027
- Issue date Dec 22, 2015
- Advanpack Solutions PTE LTD
- Hwee-Seng Jimmy Chew
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Manufacturing method for semiconductor package
- Patent number 9,136,215
- Issue date Sep 15, 2015
- Advanpack Solutions Pte. Ltd.
- Shoa Siong Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for device packaging
- Patent number 9,120,169
- Issue date Sep 1, 2015
- ORION SYSTEMS INTEGRATION PTE LTD
- Hwee Seng Chew
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing methods of semiconductor substrate, package and device
- Patent number 9,059,050
- Issue date Jun 16, 2015
- Advanpack Solutions Pte. Ltd.
- Shoa-Siong Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch-back type semiconductor package, substrate and manufacturing m...
- Patent number 8,917,521
- Issue date Dec 23, 2014
- Advanpack Solutions PTE LTD
- Hwee-Seng Jimmy Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for semiconductor device carrier and semicondu...
- Patent number 8,709,874
- Issue date Apr 29, 2014
- Advanpack Solutions PTE LTD
- Hwee-Seng Jimmy Chew
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor substrate, package and device
- Patent number 8,664,750
- Issue date Mar 4, 2014
- Advanpack Solutions Pte. Ltd.
- Shoa Siong Lim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Substrate
- Publication number 20180108584
- Publication date Apr 19, 2018
- Advanpack Solutions Pte Ltd
- Shoa-Siong Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Assembly and Method of Fabricating a Semiconductor St...
- Publication number 20170330842
- Publication date Nov 16, 2017
- Advanpack Solutions Pte Ltd
- Shoa Siong Raymond Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20170303399
- Publication date Oct 19, 2017
- Advanpack Solutions Pte Ltd
- Hwee-Seng Jimmy Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF PACKAGE SUBSTRATE AND PACKAGE MANUFACTURING...
- Publication number 20160293416
- Publication date Oct 6, 2016
- Advanpack Solutions Pte Ltd
- Shoa-Siong Raymond Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SUBSTRATE STRUCTURE
- Publication number 20160189981
- Publication date Jun 30, 2016
- Advanpack Solutions Pte Ltd
- Hwee-Seng Jimmy CHEW
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20160118349
- Publication date Apr 28, 2016
- Advanpack Solutions Pte Ltd
- Hwee-Seng Jimmy CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structure and Method of Fabricating the Same
- Publication number 20160013139
- Publication date Jan 14, 2016
- Advanpack Solutions Pte Ltd
- Shoa Siong Raymond Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR SEMICONDUCTOR PACKAGING AND METHOD OF FORMING SAME
- Publication number 20150348895
- Publication date Dec 3, 2015
- Amlan SEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20150287673
- Publication date Oct 8, 2015
- Advanpack Solutions Pte Ltd
- Shoa-Siong Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Layer Substrate For Semiconductor Packaging
- Publication number 20150155214
- Publication date Jun 4, 2015
- Advanpack Solutions Pte Ltd
- Shoa Siong Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCH-BACK TYPE SEMICONDUCTOR PACKAGE, SUBSTRATE AND MANUFACTURING M...
- Publication number 20150111345
- Publication date Apr 23, 2015
- Advanpack Solutions Pte Ltd
- Hwee-Seng Jimmy CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE CARRIER AND SEMICONDUCTOR PACKAGE USING THE SAME
- Publication number 20140167240
- Publication date Jun 19, 2014
- Advanpack Solutions Pte Ltd
- Hwee-Seng Jimmy Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHODS OF SEMICONDUCTOR SUBSTRATE, PACKAGE AND DEVICE
- Publication number 20140134806
- Publication date May 15, 2014
- ADVANPACK SOLUTIONS PTE. LTD.
- Shoa-Siong Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURE, SEMICONDUCTOR PACKAGE DEVICE, AND MANUFACTURIN...
- Publication number 20130175707
- Publication date Jul 11, 2013
- Advanpack Solutions Pte Ltd
- Hwee-Seng Jimmy Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURE, SEMICONDUCTOR PACKAGE DEVICE, AND MANUFACTURIN...
- Publication number 20130161809
- Publication date Jun 27, 2013
- Advanpack Solutions Pte Ltd
- Hwee-Seng Jimmy CHEW
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PACKAGE CARRIER, PACKAGE CARRIER MANUFACTURING METHOD, PACKAGE STRU...
- Publication number 20130113099
- Publication date May 9, 2013
- Advanpack Solutions Pte Ltd
- Shoa-Siong Raymond Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE, PACKAGE AND DEVICE AND MANUFACTURING METHO...
- Publication number 20130020710
- Publication date Jan 24, 2013
- Advanpack Solutions Pte Ltd
- Jimmy Hwee-Seng Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE CARRIER AND MANUFACTU...
- Publication number 20120058604
- Publication date Mar 8, 2012
- Advanpack Solutions Pte Ltd
- Hwee-Seng Jimmy Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-SITU MELT AND REFLOW PROCESS FOR FORMING FLIP-CHIP INTERCONNECTI...
- Publication number 20110287560
- Publication date Nov 24, 2011
- ORION SYSTEMS INTEGRATION PTE LTD
- Hwee Seng Chew
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ETCH-BACK TYPE SEMICONDUCTOR PACKAGE, SUBSTRATE AND MANUFACTURING M...
- Publication number 20110267789
- Publication date Nov 3, 2011
- Advanpack Solutions Pte Ltd
- Hwee-Seng Jimmy CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Substrate, Package and Device and Manufacturing Metho...
- Publication number 20110210429
- Publication date Sep 1, 2011
- Shoa Siong Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Manufacturing Method Thereof
- Publication number 20110210439
- Publication date Sep 1, 2011
- Shoa Siong Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Trace Substrate with Enhanced Routing Des...
- Publication number 20110210442
- Publication date Sep 1, 2011
- Shoa Siong Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING AND RELEASING INTERCONNECTS
- Publication number 20090091025
- Publication date Apr 9, 2009
- Agency for Science, Technology and Research
- Ee Hua Wong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Shoa Siong Lim

Person

Patents Grantslast 30 patents

Semiconductor structure and semiconductor package device using the...

Manufacturing method of semiconductor package

Method of manufacturing semiconductor package device

Manufacturing method of package substrate and package manufacturing...

Semiconductor package and manufacturing method thereof

Semiconductor structure and method of fabricating the same

Substrate structure, semiconductor package device, and manufacturin...

Manufacturing method of substrate structure having embedded interco...

Semiconductor package

Package carrier, package carrier manufacturing method, package stru...

Manufacturing method of forming an etch-back type semiconductor pac...

Substrate structure, semiconductor package device, and manufacturin...

Semiconductor device carrier and semiconductor package using the same

Manufacturing method for semiconductor package

Method for device packaging

Manufacturing methods of semiconductor substrate, package and device

Etch-back type semiconductor package, substrate and manufacturing m...

Manufacturing method for semiconductor device carrier and semicondu...

Semiconductor substrate, package and device

Patents Applicationslast 30 patents

Semiconductor Substrate

Semiconductor Assembly and Method of Fabricating a Semiconductor St...

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE

MANUFACTURING METHOD OF PACKAGE SUBSTRATE AND PACKAGE MANUFACTURING...

MANUFACTURING METHOD OF SUBSTRATE STRUCTURE

SEMICONDUCTOR PACKAGE

Semiconductor Structure and Method of Fabricating the Same

SUBSTRATE FOR SEMICONDUCTOR PACKAGING AND METHOD OF FORMING SAME

SEMICONDUCTOR PACKAGE

Multi-Layer Substrate For Semiconductor Packaging

ETCH-BACK TYPE SEMICONDUCTOR PACKAGE, SUBSTRATE AND MANUFACTURING M...

SEMICONDUCTOR DEVICE CARRIER AND SEMICONDUCTOR PACKAGE USING THE SAME

MANUFACTURING METHODS OF SEMICONDUCTOR SUBSTRATE, PACKAGE AND DEVICE

SUBSTRATE STRUCTURE, SEMICONDUCTOR PACKAGE DEVICE, AND MANUFACTURIN...

SUBSTRATE STRUCTURE, SEMICONDUCTOR PACKAGE DEVICE, AND MANUFACTURIN...

PACKAGE CARRIER, PACKAGE CARRIER MANUFACTURING METHOD, PACKAGE STRU...

SEMICONDUCTOR SUBSTRATE, PACKAGE AND DEVICE AND MANUFACTURING METHO...

MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE CARRIER AND MANUFACTU...

IN-SITU MELT AND REFLOW PROCESS FOR FORMING FLIP-CHIP INTERCONNECTI...

ETCH-BACK TYPE SEMICONDUCTOR PACKAGE, SUBSTRATE AND MANUFACTURING M...

Semiconductor Substrate, Package and Device and Manufacturing Metho...

Semiconductor Package and Manufacturing Method Thereof

Semiconductor Package and Trace Substrate with Enhanced Routing Des...

METHOD FOR FORMING AND RELEASING INTERCONNECTS