Shogo HIRAI

Person

Osaka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Circuit board and method of manufacturing the circuit board
- Patent number 8,658,910
- Issue date Feb 25, 2014
- Panasonic Corporation
- Tetsuro Kubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring substrate and manufacturing method of multilayer...
- Patent number 8,604,350
- Issue date Dec 10, 2013
- Panasonic Corporation
- Tsuyoshi Himori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board, wiring board manufacturing method, and via paste
- Patent number 8,563,872
- Issue date Oct 22, 2013
- Panasonic Corporation
- Shogo Hirai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solid printed circuit board and method of manufacturing the same
- Patent number 8,134,082
- Issue date Mar 13, 2012
- Panasonic Corporation
- Tadashi Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring board and its manufacturing method
- Patent number 8,076,589
- Issue date Dec 13, 2011
- Panasonic Corporation
- Tadashi Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board and manufacturing method thereof
- Patent number 7,956,293
- Issue date Jun 7, 2011
- Panasonic Corporation
- Fumio Echigo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic part and manufacturing method thereof
- Patent number 7,510,759
- Issue date Mar 31, 2009
- Panasonic Corporation
- Tsuyoshi Himori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT BOARD AND METHOD OF MANUFACTURING THE CIRCUIT BOARD
- Publication number 20130153276
- Publication date Jun 20, 2013
- Tetsuro Kubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD, PRODUCTION METHOD OF THE SAME, AND VIA PASTE
- Publication number 20130068513
- Publication date Mar 21, 2013
- KYOTO ELEX CO., LTD.
- Shogo Hirai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER WIRING BOARD AND PRODUCTION METHOD OF THE SAME
- Publication number 20130062107
- Publication date Mar 14, 2013
- PANASONIC CORPORATION
- Takayuki Higuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER WIRING BOARD, PRODUCTION METHOD OF THE SAME, AND VIA PASTE
- Publication number 20130008698
- Publication date Jan 10, 2013
- PANASONIC CORPORATION
- Tsuyoshi Himori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD, WIRING BOARD MANUFACTURING METHOD, AND VIA PASTE
- Publication number 20110290549
- Publication date Dec 1, 2011
- Shogo Hirai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER WIRING SUBSTRATE AND MANUFACTURING METHOD OF MULTILAYER...
- Publication number 20110278051
- Publication date Nov 17, 2011
- Tsuyoshi Himori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER PRINTED WIRING BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20110030207
- Publication date Feb 10, 2011
- PANASONIC CORPORATION
- Fumio ECHIGO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLID PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100170700
- Publication date Jul 8, 2010
- PANASONIC CORPORATION
- Tadashi Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER PRINTED WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20090229862
- Publication date Sep 17, 2009
- Matsushita Electric Industrial Co., Ltd.
- Tadashi Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER PRINTED WIRING BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20090139761
- Publication date Jun 4, 2009
- Matsushita Electric Industrial Co., Ltd.
- Fumio Echigo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer Wiring Board and Its Manufacturing Method
- Publication number 20080308304
- Publication date Dec 18, 2008
- Tadashi Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer Printed Wiring Board And Manufacturing Method For Same
- Publication number 20080121416
- Publication date May 29, 2008
- Matsushita Electric Industrial Co., Ltd.
- Shogo Hirai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic part and manufacturing method thereof
- Publication number 20060118905
- Publication date Jun 8, 2006
- Tsuyoshi Himori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Shogo HIRAI

Person

Patents Grantslast 30 patents

Circuit board and method of manufacturing the circuit board

Multilayer wiring substrate and manufacturing method of multilayer...

Wiring board, wiring board manufacturing method, and via paste

Solid printed circuit board and method of manufacturing the same

Multilayer wiring board and its manufacturing method

Multilayer printed wiring board and manufacturing method thereof

Electronic part and manufacturing method thereof

Patents Applicationslast 30 patents

CIRCUIT BOARD AND METHOD OF MANUFACTURING THE CIRCUIT BOARD

WIRING BOARD, PRODUCTION METHOD OF THE SAME, AND VIA PASTE

MULTILAYER WIRING BOARD AND PRODUCTION METHOD OF THE SAME

MULTILAYER WIRING BOARD, PRODUCTION METHOD OF THE SAME, AND VIA PASTE

WIRING BOARD, WIRING BOARD MANUFACTURING METHOD, AND VIA PASTE

MULTILAYER WIRING SUBSTRATE AND MANUFACTURING METHOD OF MULTILAYER...

MULTILAYER PRINTED WIRING BOARD AND MANUFACTURING METHOD THEREOF

SOLID PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

MULTILAYER PRINTED WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

MULTILAYER PRINTED WIRING BOARD AND MANUFACTURING METHOD THEREOF

Multilayer Wiring Board and Its Manufacturing Method

Multilayer Printed Wiring Board And Manufacturing Method For Same

Electronic part and manufacturing method thereof