Shohei TAGAMI

Person

Annaka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Cleaning solution for temporary adhesive for substrates, substrate...
- Patent number 12,187,989
- Issue date Jan 7, 2025
- Shin-Etsu Chemical Co., Ltd.
- Michihiro Sugo
- B08 - CLEANING
Information Patent Grant
Cleaning solution for temporary adhesive for substrates, substrate...
- Patent number 12,129,455
- Issue date Oct 29, 2024
- Shin-Etsu Chemical Co., Ltd.
- Michihiro Sugo
- B08 - CLEANING
Information Patent Grant
Temporary adhesive for wafer processing, wafer laminate and method...
- Patent number 11,970,639
- Issue date Apr 30, 2024
- Shin-Etsu Chemical Co., Ltd.
- Mitsuo Muto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer processing laminate and method for processing wafer
- Patent number 10,991,611
- Issue date Apr 27, 2021
- Shin-Etsu Chemical Co., Ltd.
- Shohei Tagami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit substrate processing laminate and method for processing cir...
- Patent number 10,854,496
- Issue date Dec 1, 2020
- Shin-Etsu Chemical Co., Ltd.
- Shohei Tagami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer processing laminate, temporary adhesive material for wafer pr...
- Patent number 10,242,902
- Issue date Mar 26, 2019
- Shin-Etsu Chemical Co., Ltd.
- Michihiro Sugo
- B32 - LAYERED PRODUCTS
Information Patent Grant
Wafer processing laminate, temporary adhesive material for wafer pr...
- Patent number 10,147,632
- Issue date Dec 4, 2018
- Shin-Etsu Chemical Co., Ltd.
- Shohei Tagami
- B32 - LAYERED PRODUCTS
Information Patent Grant
Wafer processing laminate, temporary adhesive material for wafer pr...
- Patent number 10,128,143
- Issue date Nov 13, 2018
- Shin-Etsu Chemical Co., Ltd.
- Masahito Tanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer processing laminate and method for processing wafer
- Patent number 10,115,622
- Issue date Oct 30, 2018
- Shin-Etsu Chemical Co., Ltd.
- Shohei Tagami
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Wafer processing laminate, temporary adhesive material for wafer pr...
- Patent number 10,106,713
- Issue date Oct 23, 2018
- Shin-Etsu Chemical Co., Ltd.
- Shohei Tagami
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Wafer processing bonding arrangement, wafer laminate, and thin wafe...
- Patent number 9,934,996
- Issue date Apr 3, 2018
- Shin-Etsu Chemical Co., Ltd.
- Michihiro Sugo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer processing laminate, temporary adhesive material for wafer pr...
- Patent number 9,887,118
- Issue date Feb 6, 2018
- Shin-Etsu Chemical Co., Ltd.
- Shohei Tagami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer processing laminate, wafer processing member, temporary bondi...
- Patent number 9,653,335
- Issue date May 16, 2017
- Shin-Etsu Chemical Co., Ltd.
- Hideto Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer temporary bonding method and thin wafer manufacturing method
- Patent number 9,646,868
- Issue date May 9, 2017
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki Yasuda
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer processing laminate, wafer processing member, temporary adher...
- Patent number 9,472,438
- Issue date Oct 18, 2016
- Shin-Etsu Chemical Co., Ltd.
- Kazunori Kondo
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Temporary bonding adhesive compositions and methods of manufacturin...
- Patent number 9,458,365
- Issue date Oct 4, 2016
- Shin-Etsu Chemical Co., Ltd.
- Tae-Hoon Kim
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Wafer processing laminate, wafer processing member, temporary bondi...
- Patent number 9,365,681
- Issue date Jun 14, 2016
- Shin-Etsu Chemical Co., Ltd.
- Hideto Kato
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Temporary adhesive for wafer processing, member for wafer processin...
- Patent number 9,334,424
- Issue date May 10, 2016
- Shin-Etsu Chemical Co., Ltd.
- Masahito Tanabe
- B32 - LAYERED PRODUCTS
Information Patent Grant
Wafer processing laminate, wafer processing member, temporary adher...
- Patent number 9,263,333
- Issue date Feb 16, 2016
- Shin-Etsu Chemical Co., Ltd.
- Michihiro Sugo
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Wafer processing laminate, wafer processing member, temporary bondi...
- Patent number 9,096,032
- Issue date Aug 4, 2015
- Shin-Etsu Chemical Co., Ltd.
- Hideto Kato
- B32 - LAYERED PRODUCTS
Information Patent Grant
Chemically amplified positive resist composition and pattern formin...
- Patent number 9,063,421
- Issue date Jun 23, 2015
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki Yasuda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer process body, wafer processing member, wafer processing tempo...
- Patent number 8,999,817
- Issue date Apr 7, 2015
- Shin-Etsu Chemical Co., Ltd.
- Shohei Tagami
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Temporary adhesive composition, and method of producing thin wafer
- Patent number 8,785,585
- Issue date Jul 22, 2014
- Shin-Etsu Chemical Co., Ltd.
- Masahiro Furuya
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Organopolysiloxane, temporary adhesive composition containing organ...
- Patent number 8,748,293
- Issue date Jun 10, 2014
- Shin-Etsu Chemical Co., Ltd.
- Masahiro Furuya
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Temporary adhesive composition and method for manufacturing thin wa...
- Patent number 8,735,264
- Issue date May 27, 2014
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki Yasuda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Silphenylene-containing photocurable composition, pattern formation...
- Patent number 8,715,905
- Issue date May 6, 2014
- Shin-Etsu Chemical Co., Ltd.
- Shohei Tagami
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Photo-curable resin composition, pattern forming method and substra...
- Patent number 8,673,537
- Issue date Mar 18, 2014
- Shin-Etsu Chemical Co., Ltd.
- Masahiro Furuya
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Polyimidesilicone having alcoholic hydroxyl group and process for p...
- Patent number 8,487,062
- Issue date Jul 16, 2013
- Shin-Etsu Chemical Co., Ltd.
- Michihiro Sugo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Polyimide silicone, photosensitive resin composition containing the...
- Patent number 8,263,308
- Issue date Sep 11, 2012
- Shin-Etsu Chemical Co., Ltd.
- Shohei Tagami
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Polyimide resin produced by using silphenylene compound
- Patent number 8,252,882
- Issue date Aug 28, 2012
- Shin-Etsu Chemical Co., Ltd.
- Michihiro Sugo
- C07 - ORGANIC CHEMISTRY

Patents Applicationslast 30 patents

Information Patent Application
TEMPORARY ADHESION METHOD, DEVICE WAFER PROCESSING METHOD, LAMINATE...
- Publication number 20230178412
- Publication date Jun 8, 2023
- Shin-Etsu Chemical Co., Ltd.
- Tamotsu OOWADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPORARY ADHESIVE FOR WAFER PROCESSING, WAFER LAMINATE AND METHOD...
- Publication number 20230088354
- Publication date Mar 23, 2023
- Shin-Etsu Chemical Co., Ltd.
- Mitsuo Muto
- B32 - LAYERED PRODUCTS
Information Patent Application
WAFER PROCESSING TEMPORARY ADHESIVE, WAFER LAMINATE, THIN WAFER MAN...
- Publication number 20230002647
- Publication date Jan 5, 2023
- Shin-Etsu Chemical Co., Ltd.
- Mitsuo Muto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESSING LAMINATE, TEMPORARY ADHESIVE MATERIAL FOR WAFER PR...
- Publication number 20220352001
- Publication date Nov 3, 2022
- Shin-Etsu Chemical Co., Ltd.
- Mitsuo MUTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLEANING SOLUTION FOR TEMPORARY ADHESIVE FOR SUBSTRATES, SUBSTRATE...
- Publication number 20220195352
- Publication date Jun 23, 2022
- Shin-Etsu Chemical Co., Ltd.
- Michihiro SUGO
- B08 - CLEANING
Information Patent Application
CIRCUIT SUBSTRATE PROCESSING LAMINATE AND METHOD FOR PROCESSING CIR...
- Publication number 20190318952
- Publication date Oct 17, 2019
- Shin-Etsu Chemical Co., Ltd.
- Shohei TAGAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESSING LAMINATE AND METHOD FOR PROCESSING WAFER
- Publication number 20190027391
- Publication date Jan 24, 2019
- Shin-Etsu Chemical Co., Ltd.
- Shohei TAGAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESSING LAMINATE, METHOD FOR MANUFACTURING THEREOF, AND ME...
- Publication number 20170330803
- Publication date Nov 16, 2017
- Shin-Etsu Chemical Co., Ltd.
- Shohei TAGAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESSING LAMINATE AND METHOD FOR PROCESSING WAFER
- Publication number 20170154801
- Publication date Jun 1, 2017
- Shin-Etsu Chemical Co., Ltd.
- Shohei TAGAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESSING LAMINATE, TEMPORARY ADHESIVE MATERIAL FOR WAFER PR...
- Publication number 20170110360
- Publication date Apr 20, 2017
- Shin-Etsu Chemical Co., Ltd.
- Shohei TAGAMI
- B32 - LAYERED PRODUCTS
Information Patent Application
WAFER PROCESSING LAMINATE, TEMPORARY ADHESIVE MATERIAL FOR WAFER PR...
- Publication number 20170069521
- Publication date Mar 9, 2017
- Shin-Etsu Chemical Co., Ltd.
- Michihiro SUGO
- B32 - LAYERED PRODUCTS
Information Patent Application
WAFER PROCESSING BONDING ARRANGEMENT, WAFER LAMINATE, AND THIN WAFE...
- Publication number 20170053821
- Publication date Feb 23, 2017
- Shin-Etsu Chemical Co., Ltd.
- Michihiro Sugo
- B32 - LAYERED PRODUCTS
Information Patent Application
WAFER PROCESSING LAMINATE, TEMPORARY ADHESIVE MATERIAL FOR WAFER PR...
- Publication number 20160326414
- Publication date Nov 10, 2016
- Shin-Etsu Chemical Co., Ltd.
- Shohei TAGAMI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
WAFER PROCESSING LAMINATE, TEMPORARY ADHESIVE MATERIAL FOR WAFER PR...
- Publication number 20160189996
- Publication date Jun 30, 2016
- Shin-Etsu Chemical Co., Ltd.
- Masahito TANABE
- B32 - LAYERED PRODUCTS
Information Patent Application
WAFER TEMPORARY BONDING METHOD AND THIN WAFER MANUFACTURING METHOD
- Publication number 20160189998
- Publication date Jun 30, 2016
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki Yasuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESSING LAMINATE, TEMPORARY ADHESIVE MATERIAL FOR WAFER PR...
- Publication number 20160093522
- Publication date Mar 31, 2016
- Shin-Etsu Chemical Co., Ltd.
- Shohei TAGAMI
- B32 - LAYERED PRODUCTS
Information Patent Application
TEMPORARY BONDING ADHESIVE COMPOSITIONS AND METHODS OF MANUFACTURIN...
- Publication number 20150024574
- Publication date Jan 22, 2015
- Samsung Electronics Co., Ltd.
- Tae-Hoon Kim
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
TEMPORARY ADHESIVE COMPOSITION, AND METHOD OF PRODUCING THIN WAFER
- Publication number 20140261978
- Publication date Sep 18, 2014
- SHIN-ETSU CHEMICAL CO., LTD.
- Masahiro Furuya
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CHEMICALLY AMPLIFIED POSITIVE RESIST COMPOSITION AND PATTERN FORMIN...
- Publication number 20140255833
- Publication date Sep 11, 2014
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki YASUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESSING LAMINATE, WAFER PROCESSING MEMBER, TEMPORARY ADHER...
- Publication number 20140154868
- Publication date Jun 5, 2014
- Shin-Etsu Chemical Co., Ltd.
- Michihiro SUGO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
WAFER PROCESSING LAMINATE, WAFER PROCESSING MEMBER, TEMPORARY ADHER...
- Publication number 20140106137
- Publication date Apr 17, 2014
- Shin-Etsu Chemical Co., Ltd.
- Kazunori KONDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILPHENYLENE-CONTAINING PHOTOCURABLE COMPOSITION, PATTERN FORMATION...
- Publication number 20140011126
- Publication date Jan 9, 2014
- SHIN-ETSU CHEMICAL CO., LTD.
- Shohei TAGAMI
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
TEMPORARY ADHESIVE FOR WAFER PROCESSING, MEMBER FOR WAFER PROCESSIN...
- Publication number 20130302983
- Publication date Nov 14, 2013
- Shin-Etsu Chemical Co., Ltd.
- Masahito TANABE
- B32 - LAYERED PRODUCTS
Information Patent Application
WAFER PROCESSING LAMINATE, WAFER PROCESSING MEMBER, TEMPORARY BONDI...
- Publication number 20130280886
- Publication date Oct 24, 2013
- Shin-Etsu Chemical Co., Ltd.
- Hideto Kato
- B32 - LAYERED PRODUCTS
Information Patent Application
WAFER PROCESS BODY, WAFER PROCESSING MEMBER, WAFER PROCESSING TEMPO...
- Publication number 20130220687
- Publication date Aug 29, 2013
- Shin-Etsu Chemical Co., Ltd.
- Shohei TAGAMI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CHEMICALLY AMPLIFIED POSITIVE RESIST COMPOSITION AND PATTERN FORMIN...
- Publication number 20130129988
- Publication date May 23, 2013
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki YASUDA
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
WAFER PROCESSING LAMINATE, WAFER PROCESSING MEMBER, TEMPORARY BONDI...
- Publication number 20130108866
- Publication date May 2, 2013
- Shin-Etsu Chemical Co., Ltd.
- Hideto Kato
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
TEMPORARY ADHESIVE COMPOSITION AND METHOD FOR MANUFACTURING THIN WA...
- Publication number 20130089967
- Publication date Apr 11, 2013
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki YASUDA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
WAFER PROCESSING LAMINATE, WAFER PROCESSING MEMBER, TEMPORARY BONDI...
- Publication number 20130029145
- Publication date Jan 31, 2013
- Shin-Etsu Chemical Co., Ltd.
- Hideto Kato
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ORGANOPOLYSILOXANE, TEMPORARY ADHESIVE COMPOSITION CONTAINING ORGAN...
- Publication number 20120276717
- Publication date Nov 1, 2012
- Shin-Etsu Chemical Co., Ltd.
- Masahiro FURUYA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Shohei TAGAMI

Person

Patents Grantslast 30 patents

Cleaning solution for temporary adhesive for substrates, substrate...

Cleaning solution for temporary adhesive for substrates, substrate...

Temporary adhesive for wafer processing, wafer laminate and method...

Wafer processing laminate and method for processing wafer

Circuit substrate processing laminate and method for processing cir...

Wafer processing laminate, temporary adhesive material for wafer pr...

Wafer processing laminate, temporary adhesive material for wafer pr...

Wafer processing laminate, temporary adhesive material for wafer pr...

Wafer processing laminate and method for processing wafer

Wafer processing laminate, temporary adhesive material for wafer pr...

Wafer processing bonding arrangement, wafer laminate, and thin wafe...

Wafer processing laminate, temporary adhesive material for wafer pr...

Wafer processing laminate, wafer processing member, temporary bondi...

Wafer temporary bonding method and thin wafer manufacturing method

Wafer processing laminate, wafer processing member, temporary adher...

Temporary bonding adhesive compositions and methods of manufacturin...

Wafer processing laminate, wafer processing member, temporary bondi...

Temporary adhesive for wafer processing, member for wafer processin...

Wafer processing laminate, wafer processing member, temporary adher...

Wafer processing laminate, wafer processing member, temporary bondi...

Chemically amplified positive resist composition and pattern formin...

Wafer process body, wafer processing member, wafer processing tempo...

Temporary adhesive composition, and method of producing thin wafer

Organopolysiloxane, temporary adhesive composition containing organ...

Temporary adhesive composition and method for manufacturing thin wa...

Silphenylene-containing photocurable composition, pattern formation...

Photo-curable resin composition, pattern forming method and substra...

Polyimidesilicone having alcoholic hydroxyl group and process for p...

Polyimide silicone, photosensitive resin composition containing the...

Polyimide resin produced by using silphenylene compound

Patents Applicationslast 30 patents

TEMPORARY ADHESION METHOD, DEVICE WAFER PROCESSING METHOD, LAMINATE...

TEMPORARY ADHESIVE FOR WAFER PROCESSING, WAFER LAMINATE AND METHOD...

WAFER PROCESSING TEMPORARY ADHESIVE, WAFER LAMINATE, THIN WAFER MAN...

WAFER PROCESSING LAMINATE, TEMPORARY ADHESIVE MATERIAL FOR WAFER PR...

CLEANING SOLUTION FOR TEMPORARY ADHESIVE FOR SUBSTRATES, SUBSTRATE...

CIRCUIT SUBSTRATE PROCESSING LAMINATE AND METHOD FOR PROCESSING CIR...

WAFER PROCESSING LAMINATE AND METHOD FOR PROCESSING WAFER

WAFER PROCESSING LAMINATE, METHOD FOR MANUFACTURING THEREOF, AND ME...

WAFER PROCESSING LAMINATE AND METHOD FOR PROCESSING WAFER

WAFER PROCESSING LAMINATE, TEMPORARY ADHESIVE MATERIAL FOR WAFER PR...

WAFER PROCESSING LAMINATE, TEMPORARY ADHESIVE MATERIAL FOR WAFER PR...

WAFER PROCESSING BONDING ARRANGEMENT, WAFER LAMINATE, AND THIN WAFE...

WAFER PROCESSING LAMINATE, TEMPORARY ADHESIVE MATERIAL FOR WAFER PR...

WAFER PROCESSING LAMINATE, TEMPORARY ADHESIVE MATERIAL FOR WAFER PR...

WAFER TEMPORARY BONDING METHOD AND THIN WAFER MANUFACTURING METHOD

WAFER PROCESSING LAMINATE, TEMPORARY ADHESIVE MATERIAL FOR WAFER PR...

TEMPORARY BONDING ADHESIVE COMPOSITIONS AND METHODS OF MANUFACTURIN...

TEMPORARY ADHESIVE COMPOSITION, AND METHOD OF PRODUCING THIN WAFER

CHEMICALLY AMPLIFIED POSITIVE RESIST COMPOSITION AND PATTERN FORMIN...

WAFER PROCESSING LAMINATE, WAFER PROCESSING MEMBER, TEMPORARY ADHER...

WAFER PROCESSING LAMINATE, WAFER PROCESSING MEMBER, TEMPORARY ADHER...

SILPHENYLENE-CONTAINING PHOTOCURABLE COMPOSITION, PATTERN FORMATION...

TEMPORARY ADHESIVE FOR WAFER PROCESSING, MEMBER FOR WAFER PROCESSIN...

WAFER PROCESSING LAMINATE, WAFER PROCESSING MEMBER, TEMPORARY BONDI...

WAFER PROCESS BODY, WAFER PROCESSING MEMBER, WAFER PROCESSING TEMPO...

CHEMICALLY AMPLIFIED POSITIVE RESIST COMPOSITION AND PATTERN FORMIN...

WAFER PROCESSING LAMINATE, WAFER PROCESSING MEMBER, TEMPORARY BONDI...

TEMPORARY ADHESIVE COMPOSITION AND METHOD FOR MANUFACTURING THIN WA...

WAFER PROCESSING LAMINATE, WAFER PROCESSING MEMBER, TEMPORARY BONDI...

ORGANOPOLYSILOXANE, TEMPORARY ADHESIVE COMPOSITION CONTAINING ORGAN...