SHOHTA UJIIE

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HAYAMI-GUN, JP

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Patents Grantslast 30 patents

Information Patent Grant
Multi-step sintering of metal paste for semiconductor device wire b...
- Patent number 8,815,648
- Issue date Aug 26, 2014
- Texas Instruments Incorporated
- Kengo Aoya
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LEADFRAME HAVING SLOPED METAL TERMINALS FOR WIREBONDING
- Publication number 20140091465
- Publication date Apr 3, 2014
- TEXAS INSTRUMENTS INCORPORATED
- KAZUNORI HAYATA
- H01 - BASIC ELECTRIC ELEMENTS