Shoichi Shimamura

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Saitama-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Power module and power module with heat sink
- Patent number 7,019,975
- Issue date Mar 28, 2006
- Mitsubishi Materials Corporation
- Yoshiyuki Nagatomo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Liquid-cooled heat sink and manufacturing method thereof
- Patent number 6,563,709
- Issue date May 13, 2003
- Mitsubishi Materials Corporation
- Takeshi Negishi
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Power module substrate, method of producing the same, and semicondu...
- Patent number 6,483,185
- Issue date Nov 19, 2002
- Mitsubishi Materials Corporation
- Toshiyuki Nagase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module substrate
- Patent number 6,310,775
- Issue date Oct 30, 2001
- Mitsubishi Materials Corporation
- Yoshiyuki Nagatomo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Power module and power module with heat sink
- Publication number 20040022029
- Publication date Feb 5, 2004
- Yoshiyuki Nagatomo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Liquid-cooled heat sink and manufacturing method thereof
- Publication number 20020101718
- Publication date Aug 1, 2002
- Takeshi Negishi
- F28 - HEAT EXCHANGE IN GENERAL