Shoji Ito

Person

Chiba, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Printed wiring board, method of manufacturing printed wiring board,...
- Patent number 8,604,354
- Issue date Dec 10, 2013
- Fujikura Ltd.
- Shoji Ito
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Wiring board, multilayer wiring board, and method for manufacturing...
- Patent number 7,926,175
- Issue date Apr 19, 2011
- Fujikura Ltd.
- Toshihiko Ohara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for producing multilayer printed wiring board
- Patent number 7,886,438
- Issue date Feb 15, 2011
- Fujikura Ltd.
- Shoji Ito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring board, base for multilayer wiring board, printed...
- Patent number 7,312,400
- Issue date Dec 25, 2007
- Fujikura Ltd.
- Shoji Ito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MODULE, CIRCUIT BOARD, AND MODULE MANUFACTURING METHOD
- Publication number 20100212939
- Publication date Aug 26, 2010
- Fujikura Ltd.
- Shoji Ito
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
PRINTED WIRING BOARD, METHOD OF MANUFACTURING PRINTED WIRING BOARD,...
- Publication number 20100163289
- Publication date Jul 1, 2010
- FUJIKURA LTD.
- Shoji ITO
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
PROCESS FOR PRODUCING MULTILAYER PRINTED WIRING BOARD
- Publication number 20090217522
- Publication date Sep 3, 2009
- FUJIKURA LTD.
- Shoji ITO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD, MULTILAYER WIRING BOARD, AND METHOD FOR MANUFACTURING...
- Publication number 20080016685
- Publication date Jan 24, 2008
- FUJIKURA LTD.
- Toshihiko Ohara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring board, multilayer wiring board, and method for manufacturing...
- Publication number 20060249833
- Publication date Nov 9, 2006
- FUJIKURA LTD.
- Toshihiko Ohara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer printed wiring board and process for producing the same
- Publication number 20060180344
- Publication date Aug 17, 2006
- Shoji Ito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer wiring board, base for multilayer wiring board, printed...
- Publication number 20050155792
- Publication date Jul 21, 2005
- FUJIKURA LTD.
- Shoji Ito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Person

Patents Grantslast 30 patents

Printed wiring board, method of manufacturing printed wiring board,...

Wiring board, multilayer wiring board, and method for manufacturing...

Process for producing multilayer printed wiring board

Multilayer wiring board, base for multilayer wiring board, printed...

Patents Applicationslast 30 patents

MODULE, CIRCUIT BOARD, AND MODULE MANUFACTURING METHOD

PRINTED WIRING BOARD, METHOD OF MANUFACTURING PRINTED WIRING BOARD,...

PROCESS FOR PRODUCING MULTILAYER PRINTED WIRING BOARD

WIRING BOARD, MULTILAYER WIRING BOARD, AND METHOD FOR MANUFACTURING...

Wiring board, multilayer wiring board, and method for manufacturing...

Multilayer printed wiring board and process for producing the same

Multilayer wiring board, base for multilayer wiring board, printed...