Shoji Sakemi

Person

Fukuoka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Electrode member used in a plasma treating apparatus
- Patent number 7,138,034
- Issue date Nov 21, 2006
- Matsushita Electric Industrial Co., Ltd.
- Kiyoshi Arita
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma treating apparatus, plasma treating method and method of man...
- Patent number 7,074,720
- Issue date Jul 11, 2006
- Matsushita Electric Industrial Co., Ltd.
- Kiyoshi Arita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 6,852,572
- Issue date Feb 8, 2005
- Matsushita Electric Industrial Co., Ltd.
- Hiroshi Haji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for surface treatment of silicon based substrate
- Patent number 6,784,112
- Issue date Aug 31, 2004
- Matsushita Electric Industrial Co., Ltd.
- Kiyoshi Arita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing method
- Patent number 6,723,651
- Issue date Apr 20, 2004
- Matsushita Electric Industrial Co., Ltd.
- Kiyoshi Arita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with reinforcing resin layer
- Patent number 6,683,379
- Issue date Jan 27, 2004
- Matsushita Electric Industrial Co., Ltd.
- Hiroshi Haji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor device assembly
- Patent number 6,617,675
- Issue date Sep 9, 2003
- Matsushita Electric Industrial Co., Ltd.
- Tadahiko Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for mounting conductive balls on a substrate
- Patent number 6,536,105
- Issue date Mar 25, 2003
- Matsushita Electric Industrial Co., Ltd.
- Tadahiko Sakai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of solder pre-coating and solder pre-coated circuit board
- Patent number 6,468,582
- Issue date Oct 22, 2002
- Matsushita Electric Industrial Co., Ltd.
- Shoji Sakemi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 6,350,664
- Issue date Feb 26, 2002
- Matsushita Electric Industrial Co., Ltd.
- Hiroshi Haji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of soldering bumped work by partially penetrating the oxide...
- Patent number 6,179,198
- Issue date Jan 30, 2001
- Matsushita Electric Industrial Co., Ltd.
- Hideki Eifuku
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of securely mounting conductive balls
- Patent number 6,109,509
- Issue date Aug 29, 2000
- Matsushita Electric Industrial Co., Ltd.
- Tadahiko Sakai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive ball mounting apparatus
- Patent number 5,983,490
- Issue date Nov 16, 1999
- Matsushita Electric Industrial Co., Ltd.
- Shoji Sakemi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an electronic component
- Patent number 5,909,633
- Issue date Jun 1, 1999
- Matsushita Electric Industrial Co., Ltd.
- Hiroshi Haji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure of electronic parts and method of soldering electronic pa...
- Patent number 5,894,984
- Issue date Apr 20, 1999
- Matsushita Electric Industrial Co., Ltd.
- Tadahiko Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for mounting electrically conductive balls
- Patent number 5,890,283
- Issue date Apr 6, 1999
- Matsushita Electric Industrial Co., Ltd.
- Shoji Sakemi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding electronic components
- Patent number 5,817,542
- Issue date Oct 6, 1998
- Matsushita Electric Industrial Co., Ltd.
- Shoji Sakemi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device mounting method
- Patent number 5,802,712
- Issue date Sep 8, 1998
- Matsushita Electric Industrial Co., Ltd.
- Tadahiko Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for mounting soldering balls onto surfaces of...
- Patent number 5,750,199
- Issue date May 12, 1998
- Matsushita Electric Industrial Co., Ltd.
- Shoji Sakemi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of mounting electronic connector on an end of printed circui...
- Patent number 5,713,126
- Issue date Feb 3, 1998
- Matsushita Electric Industrial Co., Ltd.
- Shoji Sakemi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for mounting soldering balls onto surfaces of...
- Patent number 5,680,984
- Issue date Oct 28, 1997
- Matsushita Electric Industrial Co., Ltd.
- Shoji Sakemi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of soldering an electronic connector on a printed circuit board
- Patent number 5,666,721
- Issue date Sep 16, 1997
- Matsushita Electric Industrial Co., Ltd.
- Shoji Sakemi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of transferring conductive balls
- Patent number 5,657,528
- Issue date Aug 19, 1997
- Matsushita Electric Industrial Co., Ltd.
- Shoji Sakemi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for mounting soldering balls onto electrodes o...
- Patent number 5,655,704
- Issue date Aug 12, 1997
- Matsushita Electric Industrial Co., Ltd.
- Shoji Sakemi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of automatically mounting electronic connector onto an end o...
- Patent number 5,548,891
- Issue date Aug 27, 1996
- Matsushita Electric Industrial Co., Ltd.
- Shoji Sakemi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming bump electrode
- Patent number 5,516,032
- Issue date May 14, 1996
- Matsushita Electric Industrial Co., Ltd.
- Shoji Sakemi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of mounting an electronic part with bumps on a circuit board
- Patent number 5,489,750
- Issue date Feb 6, 1996
- Matsushita Electric Industrial Co., Ltd.
- Shoji Sakemi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Electrode member for plasma treating apparatus, plasma treating app...
- Publication number 20020195202
- Publication date Dec 26, 2002
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Kiyoshi Arita
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Plasma treating apparatus, plasma treating method and method of man...
- Publication number 20020197877
- Publication date Dec 26, 2002
- Matsushita Electric Industrial Co. Ltd.
- Kiyoshi Arita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for surface treatment of silicon based substrate
- Publication number 20020148810
- Publication date Oct 17, 2002
- Kiyoshi Arita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plasma processing method
- Publication number 20020090826
- Publication date Jul 11, 2002
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Kiyoshi Arita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and semiconductor device assembly
- Publication number 20020084470
- Publication date Jul 4, 2002
- Tadahiko Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20020061642
- Publication date May 23, 2002
- Matsushita Electric Industrial Co., Ltd.
- Hiroshi Haji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing semiconductor device
- Publication number 20010018233
- Publication date Aug 30, 2001
- Hiroshi Haji
- H01 - BASIC ELECTRIC ELEMENTS

Shoji Sakemi

Person

Patents Grantslast 30 patents

Electrode member used in a plasma treating apparatus

Plasma treating apparatus, plasma treating method and method of man...

Method of manufacturing semiconductor device

Method for surface treatment of silicon based substrate

Plasma processing method

Semiconductor device with reinforcing resin layer

Semiconductor device and semiconductor device assembly

Method for mounting conductive balls on a substrate

Method of solder pre-coating and solder pre-coated circuit board

Semiconductor device and method of manufacturing the same

Method of soldering bumped work by partially penetrating the oxide...

Method of securely mounting conductive balls

Conductive ball mounting apparatus

Method of manufacturing an electronic component

Structure of electronic parts and method of soldering electronic pa...

Apparatus and method for mounting electrically conductive balls

Method for bonding electronic components

Electronic device mounting method

Apparatus and method for mounting soldering balls onto surfaces of...

Method of mounting electronic connector on an end of printed circui...

Apparatus and method for mounting soldering balls onto surfaces of...

Method of soldering an electronic connector on a printed circuit board

Method of transferring conductive balls

Method and apparatus for mounting soldering balls onto electrodes o...

Method of automatically mounting electronic connector onto an end o...

Method for forming bump electrode

Method of mounting an electronic part with bumps on a circuit board

Patents Applicationslast 30 patents

Electrode member for plasma treating apparatus, plasma treating app...

Plasma treating apparatus, plasma treating method and method of man...

Method for surface treatment of silicon based substrate

Plasma processing method

Semiconductor device and semiconductor device assembly

Semiconductor device and method of manufacturing the same

Method of manufacturing semiconductor device