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Neyagawa, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Apparatus and method for printing solder paste
Patent number
6,814,804
Issue date
Nov 9, 2004
Matsushita Electric Industrial Co., Ltd.
Hiroaki Onishi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Apparatus and method for printing solder paste
Patent number
6,395,335
Issue date
May 28, 2002
Matsushita Electric Industrial Co., Ltd.
Hiroaki Onishi
B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information
Patent Grant
Component affixing method and apparatus
Patent number
6,370,750
Issue date
Apr 16, 2002
Matsushita Electric Industrial Co., Ltd.
Nobuya Matsumura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Printing method and printing device
Patent number
6,092,463
Issue date
Jul 25, 2000
Matsushita Electric Industrial Co., Ltd.
Hiroaki Onishi
B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Patents Applications
last 30 patents
Information
Patent Application
Apparatus and method for printing solder paste
Publication number
20020108513
Publication date
Aug 15, 2002
HIROAKI ONISHI
B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information
Patent Application
APPARATUS AND METHOD FOR PRINTING SOLDER PASTE
Publication number
20010038882
Publication date
Nov 8, 2001
HIROAKI ONISHI
B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS