Shota KAWAGUCHI

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Ageo-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Roughened copper foil, copper-clad laminate and printed wiring board
- Patent number 12,104,265
- Issue date Oct 1, 2024
- Mitsui Mining & Smelting Co., Ltd.
- Ayumu Tateoka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Production method for copper-clad laminate plate
- Patent number 10,244,635
- Issue date Mar 26, 2019
- Mitsui Mining & Smelting Co., Ltd.
- Ayumu Tateoka
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
ROUGHENED COPPER FOIL, COPPER-CLAD LAMINATE AND PRINTED WIRING BOARD
- Publication number 20240175162
- Publication date May 30, 2024
- Mitsui Mining and Smelting Co., Ltd.
- Ayumu TATEOKA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MANUFACTURING METHODS FOR COPPER-CLAD LAMINATE AND PRINTED WIRING B...
- Publication number 20230276579
- Publication date Aug 31, 2023
- Mitsui Mining and Smelting Co., Ltd.
- Daisuke NAKAJIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER-CLAD LAMINATE PLATE AND PRINTED WIRING BOARD
- Publication number 20230276571
- Publication date Aug 31, 2023
- Mitsui Mining and Smelting Co., Ltd.
- Daisuke NAKAJIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRODUCTION METHOD FOR COPPER-CLAD LAMINATE PLATE
- Publication number 20180139848
- Publication date May 17, 2018
- Mitsui Mining and Smelting Co., Ltd.
- Ayumu TATEOKA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR