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Shizuoka, JP
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last 30 patents
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Patent Grant
Conductive composition and wiring board using the same
Patent number
11,479,686
Issue date
Oct 25, 2022
Yazaki Corporation
Rie Katsumata
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Grant
Printed circuit body
Patent number
10,231,323
Issue date
Mar 12, 2019
Yazaki Corporation
Hiroki Kondo
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT B...
Publication number
20210243893
Publication date
Aug 5, 2021
YAZAKI CORPORATION
Yukito AOYAMA
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Application
PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, AND METHOD OF MANUFACT...
Publication number
20210238442
Publication date
Aug 5, 2021
YAZAKI CORPORATION
Yukito AOYAMA
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
CONDUCTIVE COMPOSITION AND WIRING BOARD USING THE SAME
Publication number
20200190350
Publication date
Jun 18, 2020
YAZAKI CORPORATION
Rie KATSUMATA
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
PRINTED CIRCUIT BODY
Publication number
20170318663
Publication date
Nov 2, 2017
YAZAKI CORPORATION
Hiroki Kondo
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR