Shou-Cheng Hu

Person

Tai-Chung City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Embedded resistor-capacitor film for fan out wafer level packaging
- Patent number 12,100,674
- Issue date Sep 24, 2024
- Dialog Semiconductor (UK) Limited
- Ernesto Gutierrez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with discrete blocks
- Patent number 11,855,045
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Wen Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of packaging a semiconductor die
- Patent number 11,387,171
- Issue date Jul 12, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Very thin embedded trace substrate-system in package (SIP)
- Patent number 11,309,255
- Issue date Apr 19, 2022
- Dialog Semiconductor (UK) Limited
- Jesus Mennen Belonio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated type MIS substrate for thin double side SIP package
- Patent number 11,251,132
- Issue date Feb 15, 2022
- Dialog Semiconductor (UK) Limited
- Chehan Jerry Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded resistor-capacitor film for fan out wafer level packaging
- Patent number 11,239,185
- Issue date Feb 1, 2022
- Dialog Semiconductor (UK) Limited
- Ernesto Gutierrez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with discrete blocks
- Patent number 11,217,562
- Issue date Jan 4, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Wen Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level chip scale package structure
- Patent number 11,114,359
- Issue date Sep 7, 2021
- Dialog Semiconductor (UK) Limited
- Jesus Mennen Belonio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level molded PPGA (pad post grid array) for low cost package
- Patent number 11,094,669
- Issue date Aug 17, 2021
- Dialog Semiconductor B.V.
- Shou Cheng Eric Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D die stacking structure with fine pitches
- Patent number 10,854,577
- Issue date Dec 1, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and a method for forming a wafer level c...
- Patent number 10,727,174
- Issue date Jul 28, 2020
- Dialog Semiconductor (UK) Limited
- Jesus Mennen Belonio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Very thin embedded trace substrate-system in package (SIP)
- Patent number 10,636,742
- Issue date Apr 28, 2020
- Dialog Semiconductor (US) Limited
- Jesus Mennen Belonio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System in package (SIP)
- Patent number 10,629,507
- Issue date Apr 21, 2020
- Dialog Semiconductor (UK) Limited
- Che-Han Jerry Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with discrete blocks
- Patent number 10,510,727
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Wen Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with discrete blocks
- Patent number 10,008,479
- Issue date Jun 26, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Wen Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming package-on-package structures having buffer dams
- Patent number 9,837,289
- Issue date Dec 5, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shou-Cheng Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with discrete blocks
- Patent number 9,543,278
- Issue date Jan 10, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Wen Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming package-on-package structures having buffer dams
- Patent number 9,330,947
- Issue date May 3, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shou-Cheng Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for package on package devices with reversed...
- Patent number 9,293,449
- Issue date Mar 22, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shou-Cheng Hu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device with Discrete Blocks
- Publication number 20240113080
- Publication date Apr 4, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Wen Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Embedded Resistor-Capacitor Film for Fan Out Wafer Level Packaging
- Publication number 20220139850
- Publication date May 5, 2022
- Dialog Semiconductor (UK) Limited
- Ernesto Gutierrez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Discrete Blocks
- Publication number 20220122944
- Publication date Apr 21, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Wen Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MAKING
- Publication number 20210287966
- Publication date Sep 16, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hui-Min HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Very Thin Embedded Trace Substrate-System in Package (SIP)
- Publication number 20200227356
- Publication date Jul 16, 2020
- Dialog Semiconductor (UK) Limited
- Jesus Mennen Belonio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Discrete Blocks
- Publication number 20200118978
- Publication date Apr 16, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Wen Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Level Chip Scale Package Structure
- Publication number 20200091026
- Publication date Mar 19, 2020
- Dialog Semiconductor (UK) Limited
- Jesus Mennen Belonio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package and a method for Forming a Wafer Level C...
- Publication number 20200091051
- Publication date Mar 19, 2020
- Dialog Semiconductor (UK) Limited
- Jesus Mennen Belonio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Level Molded PPGA (Pad Post Grid Array) for Low Cost Package
- Publication number 20190326254
- Publication date Oct 24, 2019
- Dialog Semiconductor B.V.
- Shou Cheng Eric Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Level UGA (UBM Grid Array) & PGA (Pad Grid Array) for Low Cos...
- Publication number 20190267342
- Publication date Aug 29, 2019
- Dialog Semiconductor B.V.
- Shou Cheng Eric Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Level Molded PPGA (Pad Post Grid Array) for Low Cost Package
- Publication number 20190181115
- Publication date Jun 13, 2019
- Dialog Semiconductor (UK) Limited
- Shou Cheng Eric Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Embedded Resistor-Capacitor Film for Fan Out Wafer Level Packaging
- Publication number 20190139911
- Publication date May 9, 2019
- Dialog Semiconductor (UK) Limited
- Ernesto Gutierrez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D Die Stacking Structure with Fine Pitches
- Publication number 20190123028
- Publication date Apr 25, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Very Thin Embedded Trace Substrate-System in Package (SIP)
- Publication number 20190096815
- Publication date Mar 28, 2019
- Dialog Semiconductor (UK) Limited
- Jesus Mennen Belonio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Discrete Blocks
- Publication number 20180308824
- Publication date Oct 25, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Wen Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Discrete Blocks
- Publication number 20170125386
- Publication date May 4, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Wen Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fan-Out Interconnect Structure and Method for Forming Same
- Publication number 20160284654
- Publication date Sep 29, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods For Forming Package-On-Package Structures Having Buffer Dams
- Publication number 20160233113
- Publication date Aug 11, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shou-Cheng Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Discrete Blocks
- Publication number 20160111398
- Publication date Apr 21, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Wen Hsiao
- H01 - BASIC ELECTRIC ELEMENTS

Shou-Cheng Hu

Person

Patents Grantslast 30 patents

Embedded resistor-capacitor film for fan out wafer level packaging

Semiconductor device with discrete blocks

Method of packaging a semiconductor die

Very thin embedded trace substrate-system in package (SIP)

Integrated type MIS substrate for thin double side SIP package

Embedded resistor-capacitor film for fan out wafer level packaging

Semiconductor device with discrete blocks

Wafer level chip scale package structure

Wafer level molded PPGA (pad post grid array) for low cost package

3D die stacking structure with fine pitches

Integrated circuit package and a method for forming a wafer level c...

Very thin embedded trace substrate-system in package (SIP)

System in package (SIP)

Semiconductor device with discrete blocks

Semiconductor device with discrete blocks

Methods for forming package-on-package structures having buffer dams

Semiconductor device with discrete blocks

Methods for forming package-on-package structures having buffer dams

Methods and apparatus for package on package devices with reversed...

Patents Applicationslast 30 patents

Semiconductor Device with Discrete Blocks

Embedded Resistor-Capacitor Film for Fan Out Wafer Level Packaging

Semiconductor Device with Discrete Blocks

SEMICONDUCTOR PACKAGE AND METHOD OF MAKING

Very Thin Embedded Trace Substrate-System in Package (SIP)

Semiconductor Device with Discrete Blocks

Wafer Level Chip Scale Package Structure

Integrated Circuit Package and a method for Forming a Wafer Level C...

Wafer Level Molded PPGA (Pad Post Grid Array) for Low Cost Package

Wafer Level UGA (UBM Grid Array) & PGA (Pad Grid Array) for Low Cos...

Wafer Level Molded PPGA (Pad Post Grid Array) for Low Cost Package

Embedded Resistor-Capacitor Film for Fan Out Wafer Level Packaging

3D Die Stacking Structure with Fine Pitches

Very Thin Embedded Trace Substrate-System in Package (SIP)

Semiconductor Device with Discrete Blocks

Semiconductor Device with Discrete Blocks

Fan-Out Interconnect Structure and Method for Forming Same

Methods For Forming Package-On-Package Structures Having Buffer Dams

Semiconductor Device with Discrete Blocks