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Hsinchu, TW
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Patents Grants
last 30 patents
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Patent Grant
Cover film
Patent number
8,765,258
Issue date
Jul 1, 2014
Asia Electronic Material Co., Ltd
Chih-Ming Lin
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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Patent Grant
Composite double-sided copper foil substrates and flexible printed...
Patent number
8,536,460
Issue date
Sep 17, 2013
Asia Electronic Material Co., Ltd.
Chih-Ming Lin
B32 - LAYERED PRODUCTS
Patents Applications
last 30 patents
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Patent Application
COMPOSITE DOUBLE-SIDED COPPER FOIL SUBSTRATES AND FLEXIBLE PRINTED...
Publication number
20110114371
Publication date
May 19, 2011
ASIA ELECTRONIC MATERIAL CO., LTD
Chih-Ming Lin
B32 - LAYERED PRODUCTS
Information
Patent Application
COVER LAYER FOR PRINTED CIRCUIT BOARD
Publication number
20110086192
Publication date
Apr 14, 2011
ASIA ELECTRONIC MATERIAL CO., LTD
Chih-Ming Lin
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
COVER LAYER FOR PRINTED CIRCUIT BOARD
Publication number
20100330321
Publication date
Dec 30, 2010
ASIA ELECTRONIC MATERIAL CO., LTD
Chih-Ming Lin
G02 - OPTICS