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Shou-Xuan CHANG

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  • Tainan, TW
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    SEMICONDUCTOR PACKAGES AND MANUFACTURING METHODS THEREOF
    • Publication number 20240128635
    • Publication date Apr 18, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Yung-Ping Chiang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INTERCONNECT STRUCTURE
    • Publication number 20240055351
    • Publication date Feb 15, 2024
    • Powerchip Semiconductor Manufacturing Corporation
    • Shou-Zen Chang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CMOS IMAGE SENSOR WITH 3D MONOLITHIC OSFET AND FEMIM
    • Publication number 20240047485
    • Publication date Feb 8, 2024
    • Powerchip Semiconductor Manufacturing Corporation
    • Shou-Zen Chang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Bag Clamping and Sealing Machine
    • Publication number 20240002092
    • Publication date Jan 4, 2024
    • HON BOUW CO., LTD.
    • Shou-Tsung Chang
    • B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
  • Information Patent Application

    SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
    • Publication number 20230395698
    • Publication date Dec 7, 2023
    • Powerchip Semiconductor Manufacturing Corporation
    • Tien-Lu Lin
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Integrated Devices in Semiconductor Packages and Methods of Forming...
    • Publication number 20230369259
    • Publication date Nov 16, 2023
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Chen-Hua Yu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGE STRUCTURE WITH ANTENNA ELEMENT
    • Publication number 20230317645
    • Publication date Oct 5, 2023
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Yung-Ping CHIANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGE STRUCTURE
    • Publication number 20230261361
    • Publication date Aug 17, 2023
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Nan-Chin Chuang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
    • Publication number 20230230902
    • Publication date Jul 20, 2023
    • Powerchip Semiconductor Manufacturing Corporation
    • Chun-Lin Lu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    OXIDE SEMICONDUCTOR-BASED FRAM
    • Publication number 20230178134
    • Publication date Jun 8, 2023
    • Powerchip Semiconductor Manufacturing Corporation
    • Shou-Zen Chang
    • G11 - INFORMATION STORAGE
  • Information Patent Application

    3D MONOLITHIC STACKING MEMORY STRUCTURE
    • Publication number 20230171966
    • Publication date Jun 1, 2023
    • Powerchip Semiconductor Manufacturing Corporation
    • Shou-Zen Chang
    • G11 - INFORMATION STORAGE
  • Information Patent Application

    FERROELECTRIC MEMORY STRUCTURE
    • Publication number 20230137738
    • Publication date May 4, 2023
    • Powerchip Semiconductor Manufacturing Corporation
    • Shou-Zen Chang
    • G11 - INFORMATION STORAGE
  • Information Patent Application

    OXIDE SEMICONDUCTOR-BASED FRAM
    • Publication number 20230071750
    • Publication date Mar 9, 2023
    • Powerchip Semiconductor Manufacturing Corporation
    • Shou-Zen Chang
    • G11 - INFORMATION STORAGE
  • Information Patent Application

    FERROELECTRIC MEMORY STRUCTURE
    • Publication number 20230038759
    • Publication date Feb 9, 2023
    • Powerchip Semiconductor Manufacturing Corporation
    • Shou-Zen Chang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER STRUCTURE AND MANUFACTURING METHOD THEREOF
    • Publication number 20230034412
    • Publication date Feb 2, 2023
    • Powerchip Semiconductor Manufacturing Corporation
    • Chun-Lin Lu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Semiconductor bonding structure
    • Publication number 20230018214
    • Publication date Jan 19, 2023
    • Powerchip Semiconductor Manufacturing Corporation
    • Chun-Lin Lu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MANUFACTURING METHOD OF SRAM DEVICE
    • Publication number 20230014829
    • Publication date Jan 19, 2023
    • Powerchip Semiconductor Manufacturing Corporation
    • Shou-Zen Chang
    • G11 - INFORMATION STORAGE
  • Information Patent Application

    WAFER STACKING STRUCTURE AND MANUFACTURING METHOD THEREOF
    • Publication number 20220406722
    • Publication date Dec 22, 2022
    • Powerchip Semiconductor Manufacturing Corporation
    • Shou-Zen Chang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGES AND MANUFACTURING METHODS THEREOF
    • Publication number 20220368005
    • Publication date Nov 17, 2022
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Yung-Ping Chiang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CIRCUIT STRUCTURE FOR TESTING THROUGH SILICON VIAS IN THREE- DIMENS...
    • Publication number 20220310564
    • Publication date Sep 29, 2022
    • Powerchip Semiconductor Manufacturing Corporation
    • Shou-Zen Chang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SRAM DEVICE AND MANUFACTURING METHOD THEREOF
    • Publication number 20210335796
    • Publication date Oct 28, 2021
    • Powerchip Semiconductor Manufacturing Corporation
    • Shou-Zen Chang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SRAM DEVICE AND MANUFACTURING METHOD THEREOF
    • Publication number 20210327884
    • Publication date Oct 21, 2021
    • Powerchip Semiconductor Manufacturing Corporation
    • Shou-Zen Chang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGE STRUCTURE
    • Publication number 20210313671
    • Publication date Oct 7, 2021
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Nan-Chin Chuang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD FOR FABRICATING SUBSTRATE STRUCTURE
    • Publication number 20210296261
    • Publication date Sep 23, 2021
    • Siliconware Precision Industries Co., Ltd.
    • Po-Hao Wang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CHIP PACKAGE WITH ANTENNA ELEMENT
    • Publication number 20210265289
    • Publication date Aug 26, 2021
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Yung-Ping CHIANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGES AND MANUFACTURING MEHTODS THEREOF
    • Publication number 20210257717
    • Publication date Aug 19, 2021
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Yung-Ping Chiang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Integrated Devices in Semiconductor Packages and Methods of Forming...
    • Publication number 20210225786
    • Publication date Jul 22, 2021
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Chen-Hua Yu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    AIR FLOW GENERATING DEVICE
    • Publication number 20210140422
    • Publication date May 13, 2021
    • Wistron Corporation
    • Shou-Lun Chang
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    POWER AND SIGNAL TRANSMISSION DEVICE FOR SPINDLE OF MACHINE TOOL
    • Publication number 20210126489
    • Publication date Apr 29, 2021
    • Industrial Technology Research Institute
    • Yu-Shiang HUANG
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
    • Publication number 20210098396
    • Publication date Apr 1, 2021
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Albert Wan
    • H01 - BASIC ELECTRIC ELEMENTS