Shou-Yu HONG

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Taoyuan City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Stacked package module having an exposed heat sink surface from the...
- Patent number 10,204,882
- Issue date Feb 12, 2019
- Delta Electronics, Inc.
- Le Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package module having exposed heat sink
- Patent number 9,875,991
- Issue date Jan 23, 2018
- Delta Electronics, Inc.
- Le Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power converter and method for manufacturing the same
- Patent number 9,819,263
- Issue date Nov 14, 2017
- Delta Electronics, Inc.
- Jian-Hong Zeng
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Power module
- Patent number 8,488,316
- Issue date Jul 16, 2013
- Delta Electronics, Inc.
- Jian-Hong Zeng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power module
- Patent number 8,472,196
- Issue date Jun 25, 2013
- Delta Electronics, Inc.
- Jian-Hong Zeng
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Power semiconductor package structure and manufacturing method thereof
- Patent number 8,426,963
- Issue date Apr 23, 2013
- Delta Electronics, Inc.
- Jian-Hong Zeng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE MODULE, STACK STRUCTURE OF PACKAGE MODULE, AND FABRICATING...
- Publication number 20180082980
- Publication date Mar 22, 2018
- Delta Electronics, Inc.
- Le LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CONVERTER AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20170104410
- Publication date Apr 13, 2017
- Delta Electronics, Inc.
- Jian-Hong ZENG
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
PACKAGE MODULE, STACK STRUCTURE OF PACKAGE MODULE, AND FABRICATING...
- Publication number 20160358837
- Publication date Dec 8, 2016
- Delta Electronics, Inc.
- Le LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20120181706
- Publication date Jul 19, 2012
- Jian-Hong ZENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20120014069
- Publication date Jan 19, 2012
- Jian-Hong Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20120014059
- Publication date Jan 19, 2012
- Jian-Hong ZENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR