Shouji Itou

Person

Chiba, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing a printed wiring board
- Patent number 7,849,591
- Issue date Dec 14, 2010
- Fujikura Ltd.
- Masahiro Okamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring board assembly, multilayer wiring board assembly...
- Patent number 7,122,746
- Issue date Oct 17, 2006
- Fujikura Ltd.
- Reiji Higuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring board assembly, multilayer wiring board assembly...
- Patent number 6,914,199
- Issue date Jul 5, 2005
- Fujikura Ltd.
- Reiji Higuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring board assembly, multilayer wiring board assembly...
- Patent number 6,914,200
- Issue date Jul 5, 2005
- Fujikura Ltd.
- Reiji Higuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring board assembly, multilayer wiring board assembly...
- Patent number 6,831,236
- Issue date Dec 14, 2004
- Fujikura Ltd.
- Reiji Higuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring board assembly, multilayer wiring board assembly...
- Patent number 6,768,064
- Issue date Jul 27, 2004
- Fujikura Ltd.
- Reiji Higuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20090154132
- Publication date Jun 18, 2009
- FUJIKURA LTD.
- Masahiro Okamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer wiring board assembly, multilayer wiring board assembly...
- Publication number 20050016765
- Publication date Jan 27, 2005
- FUJIKURA LTD.
- Reiji Higuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer wiring board assembly, multilayer wiring board assembly...
- Publication number 20040195002
- Publication date Oct 7, 2004
- FUJIKURA LTD.
- Reiji Higuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer wiring board assembly, multilayer wiring board assembly...
- Publication number 20040198053
- Publication date Oct 7, 2004
- FUJIKURA LTD.
- Reiji Higuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer wiring board assembly, multilayer wiring board assembly...
- Publication number 20030019662
- Publication date Jan 30, 2003
- FUJIKURA LTD.
- Reiji Higuchi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Multilayer wiring board assembly, multilayer wiring board assembly...
- Publication number 20020134584
- Publication date Sep 26, 2002
- FUJIKURA LTD.
- Reiji Higuchi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Shouji Itou

Person

Patents Grantslast 30 patents

Method of manufacturing a printed wiring board

Multilayer wiring board assembly, multilayer wiring board assembly...

Multilayer wiring board assembly, multilayer wiring board assembly...

Multilayer wiring board assembly, multilayer wiring board assembly...

Multilayer wiring board assembly, multilayer wiring board assembly...

Multilayer wiring board assembly, multilayer wiring board assembly...

Patents Applicationslast 30 patents

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

Multilayer wiring board assembly, multilayer wiring board assembly...

Multilayer wiring board assembly, multilayer wiring board assembly...

Multilayer wiring board assembly, multilayer wiring board assembly...

Multilayer wiring board assembly, multilayer wiring board assembly...

Multilayer wiring board assembly, multilayer wiring board assembly...