Shoutian Li

Person

Naperville, IL, US

People

Patents Grantslast 30 patents

Information Patent Grant
Polishing composition and method utilizing abrasive particles treat...
- Patent number 11,034,862
- Issue date Jun 15, 2021
- CMC Materials, Inc.
- Steven Grumbine
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing composition and method utilizing abrasive particles treat...
- Patent number 10,508,219
- Issue date Dec 17, 2019
- Cabot Microelectronics Corporation
- Steven Grumbine
- B24 - GRINDING POLISHING
Information Patent Grant
CMP porous pad with particles in a polymeric matrix
- Patent number 9,951,054
- Issue date Apr 24, 2018
- Cabot Microelectronics Corporation
- Shoutian Li
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Polishing composition and method utilizing abrasive particles treat...
- Patent number 9,617,450
- Issue date Apr 11, 2017
- Cabot Microelectronics Corporation
- Steven Grumbine
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing composition and method utilizing abrasive particles treat...
- Patent number 9,028,572
- Issue date May 12, 2015
- Cabot Microelectronics Corporation
- Steven Grumbine
- B24 - GRINDING POLISHING
Information Patent Grant
Metal cations for initiating polishing
- Patent number 8,637,404
- Issue date Jan 28, 2014
- Cabot Microelectronics Corporation
- Phillip W. Carter
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Halide anions for metal removal rate control
- Patent number 8,591,763
- Issue date Nov 26, 2013
- Cabot Microelectronics Corporation
- Shoutian Li
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Iodate-containing chemical-mechanical polishing compositions and me...
- Patent number 8,551,202
- Issue date Oct 8, 2013
- Cabot Microelectronics Corporation
- Shoutian Li
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Compositions for CMP of semiconductor materials
- Patent number 8,529,680
- Issue date Sep 10, 2013
- Cabot Microelectronics Corporation
- Francesco De Rege Thesauro
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Barrier slurry for low-k dielectrics
- Patent number 8,252,687
- Issue date Aug 28, 2012
- Cabot Microelectronics Corporation
- Shoutian Li
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Tantalum CMP compositions and methods
- Patent number 7,998,228
- Issue date Aug 16, 2011
- Cabot Microelectronics Corporation
- Shoutian Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Halide anions for metal removal rate control
- Patent number 7,820,067
- Issue date Oct 26, 2010
- Cabot Microelectronics Corporation
- Shoutian Li
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Compositions and methods for CMP of semiconductor materials
- Patent number 7,803,203
- Issue date Sep 28, 2010
- Cabot Microelectronics Corporation
- Francesco De Rege Thesauro
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
POLISHING COMPOSITION AND METHOD UTILIZING ABRASIVE PARTICLES TREAT...
- Publication number 20200056069
- Publication date Feb 20, 2020
- Cabot Microelectronics Corporation
- Steven Grumbine
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING COMPOSITION AND METHOD UTILIZING ABRASIVE PARTICLES TREAT...
- Publication number 20170051181
- Publication date Feb 23, 2017
- Cabot Microelectronics Corporation
- Steven Grumbine
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METAL CATIONS FOR INITIATING POLISHING
- Publication number 20110065364
- Publication date Mar 17, 2011
- Cabot Microelectronics Corporation
- Phillip W. CARTER
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
COMPOSITIONS FOR CMP OF SEMICONDUCTOR MATERIALS
- Publication number 20100314576
- Publication date Dec 16, 2010
- Cabot Microelectronics Corporation
- Francesco DE REGE THESAURO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CMP POROUS PAD WITH PARTICLES IN A POLYMERIC MATRIX
- Publication number 20100273399
- Publication date Oct 28, 2010
- Cabot Microelectronics Corporation
- Shoutian Li
- C07 - ORGANIC CHEMISTRY
Information Patent Application
Barrier slurry for low-k dielectrics
- Publication number 20100075502
- Publication date Mar 25, 2010
- Cabot Microelectronics Corporation
- Shoutian Li
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
COMPOSITIONS AND METHODS FOR RUTHENIUM AND TANTALUM BARRIER CMP
- Publication number 20090124173
- Publication date May 14, 2009
- Cabot Microelectronics Corporation
- Shoutian Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
POLISHING COMPOSITION AND METHOD UTILIZING ABRASIVE PARTICLES TREAT...
- Publication number 20090081927
- Publication date Mar 26, 2009
- Cabot Microelectronics Corporation
- Steven Grumbine
- B24 - GRINDING POLISHING
Information Patent Application
HALIDE ANIONS FOR METAL REMOVAL RATE CONTROL
- Publication number 20080096390
- Publication date Apr 24, 2008
- Cabot Microelectronics Corporation
- Shoutian Li
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Tantalum CMP compositions and methods
- Publication number 20080016784
- Publication date Jan 24, 2008
- Shoutian Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CMP method for copper-containing substrates
- Publication number 20070249167
- Publication date Oct 25, 2007
- Cabot Microelectronics Corporation
- Jian Zhang
- B24 - GRINDING POLISHING
Information Patent Application
Iodate-containing chemical-mechanical polishing compositions and me...
- Publication number 20070224919
- Publication date Sep 27, 2007
- Cabot Microelectronics Corporation
- Shoutian Li
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Halide anions for metal removal rate control
- Publication number 20070224822
- Publication date Sep 27, 2007
- Cabot Microelectronics Corporation
- Shoutian Li
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
COMPOSITIONS AND METHODS FOR CMP OF SEMICONDUCTOR MATERIALS
- Publication number 20070181535
- Publication date Aug 9, 2007
- Cabot Microelectronics Corporation
- Francesco De Rege Thesauro
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Metal cations for initiating polishing
- Publication number 20070068087
- Publication date Mar 29, 2007
- Cabot Microelectronics Corporation
- Phillip W. Carter
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Shoutian Li

Person

Patents Grantslast 30 patents

Polishing composition and method utilizing abrasive particles treat...

Polishing composition and method utilizing abrasive particles treat...

CMP porous pad with particles in a polymeric matrix

Polishing composition and method utilizing abrasive particles treat...

Polishing composition and method utilizing abrasive particles treat...

Metal cations for initiating polishing

Halide anions for metal removal rate control

Iodate-containing chemical-mechanical polishing compositions and me...

Compositions for CMP of semiconductor materials

Barrier slurry for low-k dielectrics

Tantalum CMP compositions and methods

Halide anions for metal removal rate control

Compositions and methods for CMP of semiconductor materials

Patents Applicationslast 30 patents

POLISHING COMPOSITION AND METHOD UTILIZING ABRASIVE PARTICLES TREAT...

POLISHING COMPOSITION AND METHOD UTILIZING ABRASIVE PARTICLES TREAT...

METAL CATIONS FOR INITIATING POLISHING

COMPOSITIONS FOR CMP OF SEMICONDUCTOR MATERIALS

CMP POROUS PAD WITH PARTICLES IN A POLYMERIC MATRIX

Barrier slurry for low-k dielectrics

COMPOSITIONS AND METHODS FOR RUTHENIUM AND TANTALUM BARRIER CMP

POLISHING COMPOSITION AND METHOD UTILIZING ABRASIVE PARTICLES TREAT...

HALIDE ANIONS FOR METAL REMOVAL RATE CONTROL

Tantalum CMP compositions and methods

CMP method for copper-containing substrates

Iodate-containing chemical-mechanical polishing compositions and me...

Halide anions for metal removal rate control

COMPOSITIONS AND METHODS FOR CMP OF SEMICONDUCTOR MATERIALS

Metal cations for initiating polishing