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Shozi Ikeda
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Yokohama, JP
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last 30 patents
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Patent Grant
Wiring structure with metal wiring layers and polyimide layers, and...
Patent number
5,851,681
Issue date
Dec 22, 1998
Hitachi, Ltd.
Haruhiko Matsuyama
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...