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Shozo Hayashi
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Tokorozawa, JP
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last 30 patents
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Gold bonding wire for semiconductor elements and the semiconductor...
Patent number
4,330,329
Issue date
May 18, 1982
Tanaka Denshi Kogyo Kabushiki Kaisha
Shozo Hayashi
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...