Shrane Ning Jenq

Person

Yonghe City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Tungsten post-CMP cleaning composition
- Patent number 10,988,718
- Issue date Apr 27, 2021
- Entegris, Inc.
- Thomas Parson
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Post chemical mechanical polishing formulations and method of use
- Patent number 10,557,107
- Issue date Feb 11, 2020
- Entegris, Inc.
- Laisheng Sun
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for manufacturing copper wires on substrate of flat panel di...
- Patent number 7,393,786
- Issue date Jul 1, 2008
- Quanta Display Inc.
- Shrane-Ning Jenq
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230187378
- Publication date Jun 15, 2023
- Chipbond Technology Corporation
- Shrane-Ning Jenq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230135424
- Publication date May 4, 2023
- Chipbond Technology Corporation
- Shrane-Ning Jenq
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
TUNGSTEN POST-CMP CLEANING COMPOSITION
- Publication number 20190177671
- Publication date Jun 13, 2019
- Entegris, Inc.
- Thomas PARSON
- B08 - CLEANING
Information Patent Application
POST CHEMICAL MECHANICAL POLISHING FORMULATIONS AND METHOD OF USE
- Publication number 20180251712
- Publication date Sep 6, 2018
- Entegris, Inc.
- Laisheng Sun
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
POST CHEMICAL MECHANICAL POLISHING FORMULATIONS AND METHOD OF USE
- Publication number 20160340620
- Publication date Nov 24, 2016
- Advanced Technology Materials, Inc.
- Laisheng SUN
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Application
AQUEOUS CLEAN SOLUTION WITH LOW COPPER ETCH RATE FOR ORGANIC RESIDU...
- Publication number 20150114429
- Publication date Apr 30, 2015
- ATMI Taiwan Co., Ltd.
- Shrane Ning Jenq
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
POST-CMP FORMULATION HAVING IMPROVED BARRIER LAYER COMPATIBILITY AN...
- Publication number 20150045277
- Publication date Feb 12, 2015
- Entegris, Inc.
- Jun Liu
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Application
Method for manufacturing copper wires on substrate of flat panel di...
- Publication number 20070128857
- Publication date Jun 7, 2007
- Quanta Display Inc.
- Shrane-Ning Jenq
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Shrane Ning Jenq

Person

Patents Grantslast 30 patents

Tungsten post-CMP cleaning composition

Post chemical mechanical polishing formulations and method of use

Method for manufacturing copper wires on substrate of flat panel di...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

TUNGSTEN POST-CMP CLEANING COMPOSITION

POST CHEMICAL MECHANICAL POLISHING FORMULATIONS AND METHOD OF USE

POST CHEMICAL MECHANICAL POLISHING FORMULATIONS AND METHOD OF USE

AQUEOUS CLEAN SOLUTION WITH LOW COPPER ETCH RATE FOR ORGANIC RESIDU...

POST-CMP FORMULATION HAVING IMPROVED BARRIER LAYER COMPATIBILITY AN...

Method for manufacturing copper wires on substrate of flat panel di...