Shravan GOWRISHANKAR

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Beaverton, OR, US

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Patents Applicationslast 30 patents

Information Patent Application
BARRIER MATERIALS BETWEEN BUMPS AND PADS
- Publication number 20210057348
- Publication date Feb 25, 2021
- Intel Corporation
- Ehren HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ASSEMBLIES EMPLOYING SOLDER BONDS TO BACK-SIDE LANDS INCLUDING...
- Publication number 20190237391
- Publication date Aug 1, 2019
- Intel Corporation
- Seshu V. SATTIRAJU
- H01 - BASIC ELECTRIC ELEMENTS