Shrenik Kothari

Person

Phoenix, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device stack-up with bulk substrate material to mitig...
- Patent number 11,978,689
- Issue date May 7, 2024
- Intel Corporation
- Shrenik Kothari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device stack-up with bulk substrate material to mitig...
- Patent number 11,756,860
- Issue date Sep 12, 2023
- Intel Corporation
- Shrenik Kothari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management solutions using self-healing polymeric thermal i...
- Patent number 11,551,997
- Issue date Jan 10, 2023
- Intel Corporation
- Amitesh Saha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-surface heat sink suitable for multi-chip packages
- Patent number 11,495,518
- Issue date Nov 8, 2022
- Intel Corporation
- Shrenik Kothari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sloped metal features for cooling hotspots in stacked-die packages
- Patent number 11,398,414
- Issue date Jul 26, 2022
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded air core inductors for integrated circuit package substrat...
- Patent number 9,515,003
- Issue date Dec 6, 2016
- Intel Corporation
- Thomas Fitzgerald
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE STACK-UP WITH BULK SUBSTRATE MATERIAL TO MITIG...
- Publication number 20240234245
- Publication date Jul 11, 2024
- Intel Corporation
- Shrenik KOTHARI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STACK-UP WITH BULK SUBSTRATE MATERIAL TO MITIG...
- Publication number 20230140685
- Publication date May 4, 2023
- Intel Corporation
- Shrenik KOTHARI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DIE ARCHITECTURES WITH IMPROVED THERMAL MANAGEMENT
- Publication number 20210375719
- Publication date Dec 2, 2021
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CUSTOMIZED INTEGRATED HEAT SPREADER DESIGN WITH TARGETED DOPING FOR...
- Publication number 20210257272
- Publication date Aug 19, 2021
- Intel Corporation
- Shrenik KOTHARI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STACK-UP WITH BULK SUBSTRATE MATERIAL TO MITIG...
- Publication number 20210028087
- Publication date Jan 28, 2021
- Intel Corporation
- Shrenik KOTHARI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MANAGEMENT SOLUTIONS USING SELF-HEALING POLYMERIC THERMAL I...
- Publication number 20200294886
- Publication date Sep 17, 2020
- Intel Corporation
- Amitesh Saha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-SURFACE HEAT SINK SUITABLE FOR MULTI-CHIP PACKAGES
- Publication number 20200251403
- Publication date Aug 6, 2020
- Intel Corporation
- Shrenik Kothari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-PIECE HEAT SPREADER FOR MULTI-CHIP PACKAGE
- Publication number 20200194332
- Publication date Jun 18, 2020
- Intel Corporation
- Sandeep Ahuja
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SLOPED METAL FEATURES FOR COOLING HOTSPOTS IN STACKED-DIE PACKAGES
- Publication number 20200098666
- Publication date Mar 26, 2020
- Intel Corporation
- ZHIMIN WAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DIE ARCHITECTURES WITH IMPROVED THERMAL MANAGEMENT
- Publication number 20190214328
- Publication date Jul 11, 2019
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINTERED HEAT SPREADERS WITH INSERTS
- Publication number 20190027379
- Publication date Jan 24, 2019
- Intel Corporation
- Wei Hu
- H01 - BASIC ELECTRIC ELEMENTS

Shrenik Kothari

Person

Patents Grantslast 30 patents

Semiconductor device stack-up with bulk substrate material to mitig...

Semiconductor device stack-up with bulk substrate material to mitig...

Thermal management solutions using self-healing polymeric thermal i...

Multi-surface heat sink suitable for multi-chip packages

Sloped metal features for cooling hotspots in stacked-die packages

Embedded air core inductors for integrated circuit package substrat...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE STACK-UP WITH BULK SUBSTRATE MATERIAL TO MITIG...

SEMICONDUCTOR DEVICE STACK-UP WITH BULK SUBSTRATE MATERIAL TO MITIG...

STACKED DIE ARCHITECTURES WITH IMPROVED THERMAL MANAGEMENT

CUSTOMIZED INTEGRATED HEAT SPREADER DESIGN WITH TARGETED DOPING FOR...

SEMICONDUCTOR DEVICE STACK-UP WITH BULK SUBSTRATE MATERIAL TO MITIG...

THERMAL MANAGEMENT SOLUTIONS USING SELF-HEALING POLYMERIC THERMAL I...

MULTI-SURFACE HEAT SINK SUITABLE FOR MULTI-CHIP PACKAGES

MULTI-PIECE HEAT SPREADER FOR MULTI-CHIP PACKAGE

SLOPED METAL FEATURES FOR COOLING HOTSPOTS IN STACKED-DIE PACKAGES

STACKED DIE ARCHITECTURES WITH IMPROVED THERMAL MANAGEMENT

SINTERED HEAT SPREADERS WITH INSERTS