Shu-Chen LI

Person

Yuanli Township, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Interconnection structure and methods of forming the same
- Patent number 12,068,254
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with two-dimensional conductive structures
- Patent number 12,068,253
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Shu-Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and methods of forming the same
- Patent number 12,062,612
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two 2D capping layers on interconnect conductive structure to incre...
- Patent number 12,051,645
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having vertical conductive graphene and met...
- Patent number 11,948,837
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Fu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Graded metallic liner for metal interconnect structures and methods...
- Patent number 11,682,620
- Issue date Jun 20, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Shu-Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 11,682,616
- Issue date Jun 20, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Meng-Pei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and methods of forming the same
- Patent number 11,670,595
- Issue date Jun 6, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chen Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure with hybrid barrier layer
- Patent number 11,652,055
- Issue date May 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming interconnection structure including conductive g...
- Patent number 11,640,940
- Issue date May 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and methods of forming the same
- Patent number 11,605,591
- Issue date Mar 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two 2D capping layers on interconnect conductive structure to incre...
- Patent number 11,532,549
- Issue date Dec 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method of high power nanosecond mode-locked solid sta...
- Patent number 11,211,771
- Issue date Dec 28, 2021
- HONG YANG LASER SERVICE CO., LTD.
- Yung-Fu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display Device
- Patent number 10,235,921
- Issue date Mar 19, 2019
- AU OPTRONICS CORPORATION
- Kun-Cheng Tien
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Display panel and method for driving display panel based on a first...
- Patent number 10,176,771
- Issue date Jan 8, 2019
- AU OPTRONICS CORPORATION
- Kun-Cheng Tien
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Polyester and method of manufacturing the same
- Patent number 10,100,440
- Issue date Oct 16, 2018
- INDUSTRIAL TECHNOLOGY RESEARCH INSTITTUTE
- Cheng-Jyun Huang
- D01 - NATURAL OR ARTIFICIAL THREADS OR FIBRES SPINNING
Information Patent Grant
Fiber and method of manufacturing the same
- Patent number 10,094,050
- Issue date Oct 9, 2018
- Industrial Technology Research Institute
- Cheng-Jyun Huang
- D01 - NATURAL OR ARTIFICIAL THREADS OR FIBRES SPINNING
Information Patent Grant
Pixel structure
- Patent number 9,864,245
- Issue date Jan 9, 2018
- Au Optronics Corporation
- Kun-Cheng Tien
- G02 - OPTICS
Information Patent Grant
Pixel structure and pixel array having the same
- Patent number 9,568,773
- Issue date Feb 14, 2017
- Au Optronics Corporation
- Chih-Chang Shih
- G02 - OPTICS
Information Patent Grant
Pixel structure
- Patent number 9,389,470
- Issue date Jul 12, 2016
- Au Optronics Corporation
- Kun-Cheng Tien
- G02 - OPTICS
Information Patent Grant
Plasticizer, a biodegradable material comprising the plasticizer an...
- Patent number 8,901,210
- Issue date Dec 2, 2014
- Industrial Technology Research Institute
- Hsiu-Yu Cheng
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
High write selectivity and low power magnetic random access memory...
- Patent number 7,359,237
- Issue date Apr 15, 2008
- Industrial Technology Research Institute
- Chien-Chung Hung
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240387251
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Wei LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240379558
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Wei LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240363534
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Wei LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240363538
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- SHU-WEI LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING LINER STRUCTURE
- Publication number 20240321632
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Fu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
2D LAYER ON INTERCONNECT CONDUCTIVE STRUCTURE
- Publication number 20240282697
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING VERTICAL CONDUCTIVE GRAPHENE AND MET...
- Publication number 20240203789
- Publication date Jun 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Fu YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES AND MANUFACTURING METHOD THEREOF
- Publication number 20240088042
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- SHU-WEI LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW RESISTANCE INTERCONNECT FEATURES AND METHOD FOR MANUFACTURING T...
- Publication number 20240071822
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Lung CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA CONNECTION STRUCTURE HAVING MULTIPLE VIA TO VIA CONNECTIONS
- Publication number 20230386969
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Yu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING VERTICLE CONDUCTIVE GRAPHENE AND MET...
- Publication number 20230378067
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsu-Chun KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING GRAPHENE INTERCONNECT AND METHOD OF...
- Publication number 20230335497
- Publication date Oct 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20230275027
- Publication date Aug 31, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chen CHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20230268274
- Publication date Aug 24, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Wei LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE WITH HYBRID BARRIER LAYER
- Publication number 20230253330
- Publication date Aug 10, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20230207461
- Publication date Jun 29, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Wei LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING VERTICAL CONDUCTIVE GRAPHENE AND MET...
- Publication number 20230064444
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Fu YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING VERTICLE CONDUCTIVE GRAPHENE AND MET...
- Publication number 20230066891
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsu-Chun KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20230062128
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Wei LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230037554
- Publication date Feb 9, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- SHU-WEI LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE WITH HYBRID BARRIER LAYER
- Publication number 20220415798
- Publication date Dec 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR STRUCTURE
- Publication number 20220359378
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- MENG-PEI LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO 2D CAPPING LAYERS ON INTERCONNECT CONDUCTIVE STRUCTURE TO INCRE...
- Publication number 20220359381
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20220359414
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Wei LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20220319989
- Publication date Oct 6, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Wei LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRADED METALLIC LINER FOR METAL INTERCONNECT STRUCTURES AND METHODS...
- Publication number 20220302039
- Publication date Sep 22, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Shu-Wei LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20220270970
- Publication date Aug 25, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chen CHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO 2D CAPPING LAYERS ON INTERCONNECT CONDUCTIVE STRUCTURE TO INCRE...
- Publication number 20220157710
- Publication date May 19, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shu-Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20220068799
- Publication date Mar 3, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- MENG-PEI LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD OF HIGH POWER NANOSECOND MODE-LOCKED SOLID STA...
- Publication number 20200403374
- Publication date Dec 24, 2020
- Hong Yang Laser Service Co., Ltd.
- Yung-Fu Chen
- H01 - BASIC ELECTRIC ELEMENTS

Shu-Chen LI

Person

Patents Grantslast 30 patents

Interconnection structure and methods of forming the same

Semiconductor structure with two-dimensional conductive structures

Semiconductor device structure and methods of forming the same

Two 2D capping layers on interconnect conductive structure to incre...

Semiconductor structure having vertical conductive graphene and met...

Graded metallic liner for metal interconnect structures and methods...

Semiconductor structure and method for forming the same

Semiconductor device structure and methods of forming the same

Interconnect structure with hybrid barrier layer

Methods of forming interconnection structure including conductive g...

Semiconductor device structure and methods of forming the same

Two 2D capping layers on interconnect conductive structure to incre...

Apparatus and method of high power nanosecond mode-locked solid sta...

Display Device

Display panel and method for driving display panel based on a first...

Polyester and method of manufacturing the same

Fiber and method of manufacturing the same

Pixel structure

Pixel structure and pixel array having the same

Pixel structure

Plasticizer, a biodegradable material comprising the plasticizer an...

High write selectivity and low power magnetic random access memory...

Patents Applicationslast 30 patents

INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME

INTERCONNECTION STRUCTURE AND METHODS OF FORMING THE SAME

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE INCLUDING LINER STRUCTURE

2D LAYER ON INTERCONNECT CONDUCTIVE STRUCTURE

SEMICONDUCTOR STRUCTURE HAVING VERTICAL CONDUCTIVE GRAPHENE AND MET...

SEMICONDUCTOR STRUCTURES AND MANUFACTURING METHOD THEREOF

LOW RESISTANCE INTERCONNECT FEATURES AND METHOD FOR MANUFACTURING T...

VIA CONNECTION STRUCTURE HAVING MULTIPLE VIA TO VIA CONNECTIONS

SEMICONDUCTOR STRUCTURE HAVING VERTICLE CONDUCTIVE GRAPHENE AND MET...

SEMICONDUCTOR DEVICE INCLUDING GRAPHENE INTERCONNECT AND METHOD OF...

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

INTERCONNECTION STRUCTURE AND METHODS OF FORMING THE SAME

INTERCONNECT STRUCTURE WITH HYBRID BARRIER LAYER

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

SEMICONDUCTOR STRUCTURE HAVING VERTICAL CONDUCTIVE GRAPHENE AND MET...

SEMICONDUCTOR STRUCTURE HAVING VERTICLE CONDUCTIVE GRAPHENE AND MET...

INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME

SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME

INTERCONNECT STRUCTURE WITH HYBRID BARRIER LAYER

METHOD FOR FORMING SEMICONDUCTOR STRUCTURE

TWO 2D CAPPING LAYERS ON INTERCONNECT CONDUCTIVE STRUCTURE TO INCRE...

INTERCONNECTION STRUCTURE AND METHODS OF FORMING THE SAME

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

GRADED METALLIC LINER FOR METAL INTERCONNECT STRUCTURES AND METHODS...

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

TWO 2D CAPPING LAYERS ON INTERCONNECT CONDUCTIVE STRUCTURE TO INCRE...

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

APPARATUS AND METHOD OF HIGH POWER NANOSECOND MODE-LOCKED SOLID STA...