Shu Dobashi

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Joetsu-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Polyamideimide resin for flexible printed circuit boards; metal-cla...
- Patent number 8,546,511
- Issue date Oct 1, 2013
- Arisawa Mfg. Co., Ltd.
- Makoto Tai
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
FIRE-RETARDANT RESIN COMPOSITION, METAL-CLAD BASE LAMINATE FOR FLEX...
- Publication number 20140224529
- Publication date Aug 14, 2014
- Arisawa Mfg. Co., Ltd.
- Shu Dobashi
- B32 - LAYERED PRODUCTS
Information Patent Application
POLYAMIDEIMIDE RESIN FOR FLEXIBLE PRINTED CIRCUIT BOARDS; METAL-CLA...
- Publication number 20100186998
- Publication date Jul 29, 2010
- Arisawa Mfg. Co., Ltd.
- Makoto Tai
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Polyamideimide resin for flexible printed circuit boards; metal-cla...
- Publication number 20070166559
- Publication date Jul 19, 2007
- Arisawa Mfg. Co., Ltd.
- Makoto Tai
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...