Shu Jin

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Sunnyvale, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Copper alloys for interconnections having improved electromigration...
- Patent number 7,220,674
- Issue date May 22, 2007
- Intel Corporation
- Thomas N. Marieb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper alloys for interconnections having improved electromigration...
- Patent number 6,977,220
- Issue date Dec 20, 2005
- Intel Corporation
- Thomas N. Marieb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper alloys for interconnections having improved electromigration...
- Patent number 6,800,554
- Issue date Oct 5, 2004
- Intel Corporation
- Thomas N. Marieb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density plasma physical vapor deposition
- Patent number 5,792,522
- Issue date Aug 11, 1998
- Intel Corporation
- Shu Jin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
Copper alloys for interconnections having improved electromigration...
- Publication number 20040224507
- Publication date Nov 11, 2004
- Thomas N. Marieb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper alloys for interconnections having improved electromigration...
- Publication number 20040219788
- Publication date Nov 4, 2004
- Thomas N. Marieb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper alloys for interconnections having improved electromigration...
- Publication number 20020076925
- Publication date Jun 20, 2002
- Thomas N. Marieb
- H01 - BASIC ELECTRIC ELEMENTS