Shu-Jung Tseng

Person

Tai-Chung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Package substrate insulation opening design
- Patent number 12,368,092
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shu-Jung Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 12,107,038
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Jung Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate insulation opening design
- Patent number 11,817,382
- Issue date Nov 14, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shu-Jung Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and method of manufacturing the same
- Patent number 11,600,562
- Issue date Mar 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Jung Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate insulation opening design
- Patent number 11,251,114
- Issue date Feb 15, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shu-Jung Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Production and packaging control for repaired integrated circuits
- Patent number 7,521,266
- Issue date Apr 21, 2009
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Jung Tseng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240387497
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Jung Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20240371745
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Jung Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Substrate Insulation Opening Design
- Publication number 20230369193
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shu-Jung Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20230170291
- Publication date Jun 1, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Jung Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE
- Publication number 20230060520
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Jung Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE INSULATION OPENING DESIGN
- Publication number 20220165655
- Publication date May 26, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shu-Jung Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220122909
- Publication date Apr 21, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Jung Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE INSULATION OPENING DESIGN
- Publication number 20210343633
- Publication date Nov 4, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shu-Jung Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Production and packaging control for repaired integrated circuits
- Publication number 20070111402
- Publication date May 17, 2007
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Jung Tseng
- H01 - BASIC ELECTRIC ELEMENTS

Shu-Jung Tseng

Person

Patents Grantslast 30 patents

Package substrate insulation opening design

Semiconductor packages

Package substrate insulation opening design

Semiconductor packages and method of manufacturing the same

Package substrate insulation opening design

Production and packaging control for repaired integrated circuits

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGES

Package Substrate Insulation Opening Design

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE

PACKAGE SUBSTRATE INSULATION OPENING DESIGN

SEMICONDUCTOR PACKAGES AND METHOD OF MANUFACTURING THE SAME

PACKAGE SUBSTRATE INSULATION OPENING DESIGN

Production and packaging control for repaired integrated circuits