Shu Kin Yau

Person

Hong Kong, HK

People

Patents Grantslast 30 patents

Information Patent Grant
High voltage power device with hybrid Schottky trenches and method...
- Patent number 10,916,626
- Issue date Feb 9, 2021
- Hong Kong Applied Science and Technology Research Institute Co., Ltd.
- Shu Kin Yau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon-carbide shielded-MOSFET embedded with a trench Schottky dio...
- Patent number 10,777,689
- Issue date Sep 15, 2020
- Hong Kong Applied Science and Technology Research Institute Company, Limited
- Shu Kin Yau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High voltage silicon carbide Schottky diode flip chip array
- Patent number 10,615,292
- Issue date Apr 7, 2020
- Hong Kong Applied Science and Technology Research Institute Co., Ltd.
- Siu Wai Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alternate plating and etching processes for through hole filling
- Patent number 9,991,161
- Issue date Jun 5, 2018
- Hong Kong Applied Science and Technology Research Institute Company Limited
- Yaofeng Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for fast evaluation of electroplating formulat...
- Patent number 9,617,653
- Issue date Apr 11, 2017
- Hong Kong Applied Science and Technology Research Institute Company Limited
- Yaofeng Sun
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Additive for electrodeposition
- Patent number 9,273,407
- Issue date Mar 1, 2016
- Hong Kong Applied Science and Technology Research Institute Company Limited
- Jiye Luo
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Low cost backside illuminated CMOS image sensor package with high i...
- Patent number 8,823,126
- Issue date Sep 2, 2014
- Hong Kong Applied Science and Technology Research Institute Company Limited
- Dan Yang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Silicon-Carbide (SiC) Metal-Oxide-Semiconductor Field-Effect Transi...
- Publication number 20230327018
- Publication date Oct 12, 2023
- Hong Kong Applied Science and Technology Research Institute Company Limited
- Shu Kin YAU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Voltage Power Device with Hybrid Schottky Trenches and Method...
- Publication number 20200212177
- Publication date Jul 2, 2020
- Hong Kong Applied Science and Technology Research Institute Co., Ltd.
- Shu Kin Yau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Voltage Silicon Carbide Schottky Diode Flip Chip Array
- Publication number 20190305141
- Publication date Oct 3, 2019
- Hong Kong Applied Science and Technology Research Institute Co., Ltd.
- Siu Wai Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLATING LEVELER FOR ELECTRODEPOSITION OF COPPER PILLAR
- Publication number 20170183791
- Publication date Jun 29, 2017
- Hong Kong Applied Science and Technology Research Institute Company Limited
- Yaofeng SUN
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Additive for Electrodeposition
- Publication number 20150259814
- Publication date Sep 17, 2015
- Hong Kong Applied Science and Technology Research Institute Co., Ltd.
- JIYE LUO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Apparatus and Method for Fast Evaluation of Electroplating Formulat...
- Publication number 20150167195
- Publication date Jun 18, 2015
- Hong Kong Applied Science and Technology Research Institute Company Limited
- YAOFENG SUN
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
LOW COST BACKSIDE ILLUMINATED CMOS IMAGE SENSOR PACKAGE WITH HIGH I...
- Publication number 20130292787
- Publication date Nov 7, 2013
- Hong Kong Applied Science and Technology Research Institute Company Limited
- Dan Yang
- H01 - BASIC ELECTRIC ELEMENTS

Shu Kin Yau

Person

Patents Grantslast 30 patents

High voltage power device with hybrid Schottky trenches and method...

Silicon-carbide shielded-MOSFET embedded with a trench Schottky dio...

High voltage silicon carbide Schottky diode flip chip array

Alternate plating and etching processes for through hole filling

Apparatus and method for fast evaluation of electroplating formulat...

Additive for electrodeposition

Low cost backside illuminated CMOS image sensor package with high i...

Patents Applicationslast 30 patents

Silicon-Carbide (SiC) Metal-Oxide-Semiconductor Field-Effect Transi...

High Voltage Power Device with Hybrid Schottky Trenches and Method...

High Voltage Silicon Carbide Schottky Diode Flip Chip Array

PLATING LEVELER FOR ELECTRODEPOSITION OF COPPER PILLAR

Additive for Electrodeposition

Apparatus and Method for Fast Evaluation of Electroplating Formulat...

LOW COST BACKSIDE ILLUMINATED CMOS IMAGE SENSOR PACKAGE WITH HIGH I...